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ULT significantly delayed renal disease progression in hyperuricemic patients with CKD. Goal-directed ULT seems to be better than continuing the initial ULT prescription.

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Coarse-grained reconfigurable architectures (CGRAs) require many processing elements (PEs) and a configuration memory unit (configuration cache) for reconfiguration of its PE array. Although this structure is meant for high performance and flexibility, it consumes significant power. Specially, power consumption by configuration cache is explicit overhead compared to other types of intellectual property (IP) cores. Reducing power is very crucial for CGRA to be more competitive and reliable processing core in embedded systems. In this paper, we propose a reusable context pipelining (RCP) architecture to reduce power-overhead caused by reconfiguration. It shows that the power reduction can be achieved by using the characteristics of loop pipelining, which is a multiple instruction stream, multiple data stream (MIMD)-style execution model. RCP efficiently reduces power consumption in configuration cache without performance degradation. Experimental results show that the proposed approach saves much power even with reduced configuration cache size. Power reduction ratio in the configuration cache and the entire architecture are up to 86.33% and 37.19%, respectively, compared to the base architecture.Index Terms-Coarse-grained reconfigurable architecture, configuration cache, embedded system, loop pipelining, low power.

The ability to control the properties of dielectric thin films on demand is of fundamental interest in nanoscale devices. Here, we modulate plasma characteristics at the surface of a substrate to tune both dielectric constant and thermal conductivity of amorphous thin films grown using plasmaenhanced atomic layer deposition. Specifically, we apply a substrate bias ranging from 0 to ∼117 V and demonstrate the systematic tunability of various material parameters of Al 2 O 3 . As a function of the substrate bias, we find a nonmonotonical evolution of intrinsic properties, including density, dielectric constant, and thermal conductivity. A key observation is that the maximum values in dielectric constant and effective thermal conductivity emerge at different substrate biases. The impact of density on both thermal conductivity and dielectric constant is further examined using a differential effective medium theory and the Clausius−Mossotti model, respectively. We find that the peak value in the dielectric constant deviates from the Clausius−Mossotti model, indicating the change of oxygen fraction in our thin films as a function of substrate bias. This finding suggests that the increased local strength of plasma sheath not only enhances material density but also controls the dynamics of microstructural defect formation beyond what is possible with conventional approaches. Based on our experimental observations and modeling, we further build a phenomenological relation between dielectric constant and thermal conductivity. Our results pave invaluable avenues for optimizing dielectric thin films at the atomic scale for a wide range of applications in nanoelectronics and energy devices.

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