A Fast Loss and Temperature Simulation Method for Power Converters, Part I: Electrothermal Modeling and Validation

Design Optimization of Hybrid-Switch Soft-Switching Inverters Using Multiscale Electrothermal Simulation

“…In [19], [20] and [21] While Fourier-based methods are advertised to be much quicker than finite difference methods (FDMs), the computation savings may not be as obvious once a full 3-D multichip chip configuration is considered requiring large feedback gains and a large number of Fourier terms solved numerically for accurate solutions. In addition, the Fourier-based solutions do not consider the imperfect contact that may exist between materials that can result in significant temperature differences.…”

Compact Electrothermal Reliability Modeling and Experimental Characterization of Bipolar Latchup in SiC and CoolMOS Power MOSFETs

“…There have been several publications that have detailed how the minority carrier distribution profile in the drift region can be modelled using the Fourier series solution to the ambipolar diffusion equation (ADE) [9,[13][14][15][16][17][18][19][20][21][22][23][24]. The reverse recovery characteristics of the PiN body diode in this paper have been modelled using the same techniques developed for discrete PiN diodes.…”

“…All the terminal voltages and currents were captured on a Tektronix oscilloscope. The semiconductor devices were placed in a thermal chamber where the ambient temperature was varied in order to analyse the temperature dependencies of the switching transients [22,23,25,26]. Fig.…”

A thermal modeling methodology for power semiconductor modules

“…heat spreading. In order to simulate a 3D power module with little computation time Fourier series-based models have been developed in [8] and [9]. They are based on multiple problem sets, one for each material layer, formulated as Fourier series.…”