1 A test system is introduced and applied for validation of dynamic electro-thermal models of multichip insulated gate bipolar transistor (IGBT) modules. The test system operates the IGBT in a pulsed high power active mode with controlled current and voltage. The gatecathode voltage is used as a time-dependent temperature sensitive parameter (TSP). The TSP is calibrated versus temperature with a temperature controlled test fixture using short pulses that do not result in self heating. It is shown that the temperature calibrations for the TSP must be performed on the same IGBT, and under the same conditions for which a transient measurement is to be made. Heating transient measurements are made for both multiple paralleled chips and for a single isolated chip in the same module. Comparisons between measurements of the single IGBT chip and paralleled chips indicate that current sharing is adequate for high-current, low-voltage heating conditions but is not adequate for high-voltage, low-current conditions. Model validation results indicate good performance of a previously developed IGBT electrothermal model for the range of heating rates tested.
Thermal component models are developed for multi-chip of insulated gate bipolar transistor (IGBT) power electronic modules (PEM) and associated high-power converter heat sinks. The models are implemented in SABER † † and are combined with the electro-thermal IGBT and diode models to simulate the electro-thermal performance of high power converter systems. The thermal component models are parameterized in terms of structural and material parameters so that they can be readily used to develop a library of component models for the various commercially available power modules. The paper presents model development and implementation in SABER † † , simulation results, and validation using experimental data.
The development of a fully automated tool that is used to optimize the design of a hybrid switch soft-switching inverter using a library of dynamic electro-thermal component models parameterized in terms of electrical, structural and material properties is presented. A multi-scale electro-thermal simulation approach is developed allowing for a large number of parametric studies involving multiple design variables to be considered, drastically reducing simulation time.Traditionally, electro-thermal simulation and analysis has been used to predict the behavior of pre-existing designs. While the traditional approach to electro-thermal analysis can help shape cooling requirements and heat sink designs to maintain certain junction temperatures, there is no guarantee that the design under study is the most optimal. This dissertation uses electro-thermal simulation to guarantee an optimal design and thus truly minimizing cooling requirements and improving device reliability.The proposed optimization tool is used to provide a step-by-step design optimization of a twocoupled magnetic hybrid soft-switching inverter. The soft-switching inverter uses a two-coupled magnetic approach for transformer reset condition [1], a variable timing control for achieving ZVS over the entire load range [2], and utilizes a hybrid switch approach for the main device [3].
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