No abstract

This paper reports a hybrid integrated light source fabricated on a Si platform using a spot-size converter (SSC) with a trident Si waveguide. Low-loss coupling for 1.55 μm and 1.3 μm wavelengths was achieved with merely the simple planar form of a Si waveguide with no use of complicated structures such as vertical tapers or an extra dielectric core overlaid on the waveguide. The coupling loss tolerance up to a 1 dB loss increase was larger than the accuracy of our passive alignment technology. The coupling efficiency was quite robust against manufacturing variations in the waveguide width compared with that of a conventional SSC with an inverse taper waveguide. A multi-channel light source with highly uniform output power and a high-temperature light source were fabricated with a 1.55 μm quantum well laser and a 1.3 μm quantum dot laser, respectively. The integration scheme we report can be used to fabricate light sources for high-density, multi-channel Si optical interposers.

Engineers are currently facing some technical issues in support of the exponential performance growths in information industries. One of the most serious issues is a bottleneck of inter-chip interconnects. We propose a new "Photonics-Electronics Convergence System" concept. High density optical interconnects integrated with a 13-channel arrayed laser diode, silicon optical modulators, germanium photodetectors, and silicon optical waveguides on single silicon substrate were demonstrated for the first time using this system. A 5-Gbps error free data transmission and a 3.5-Tbps/cm(2) transmission density were achieved. We believe that this technology will solve the bandwidth bottleneck problem among LSI chips in the future.

No abstract

No abstract

No abstract

One of the most serious issues in information industries is the bandwidth bottleneck in inter-chip interconnects. We propose a photonics-electronics convergence system to solve this issue. We fabricated a high density optical interposer to demonstrate the feasibility of the system by using silicon photonics integrated with an arrayed laser diode, an optical splitter, silicon optical modulators, germanium photodetectors, and silicon optical waveguides on a single silicon substrate. Error-free data transmission at 12.5 Gbps and a transmission density of 6.6 Tbps/cm² were achieved with the optical interposer. We believe this technology will solve the bandwidth bottleneck problem in the future.

No abstract