Silicon photonics for next generation system integration platform

Arakawa, Yasuhiko; Nakamura, Takahiro; Urino, Yutaka; Fujita, Takaya

doi:10.1109/mcom.2013.6476868

Cited by 268 publications

(123 citation statements)

References 8 publications

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“…The last decade has seen Si-photonics promoted as a platform for potentially revolutionary advances in the fields of Telecommunications, Data Communications, Medical Technology, Security, and Sensing [1][2][3]. The main driving force behind Si-photonics is the potential to realize small, highly integrated, photonic sub-systems that leverage off the decades of fabrication experience, technology, and scalability already developed for CMOS (complementary metal-oxide semiconductor) electronics [4].…”

Section: Introductionmentioning

confidence: 99%

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

et al. 2016

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Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into a durable module. Photonic packaging of PICs is significantly more challenging, and currently orders of magnitude more expensive, than electronic packaging, because it calls for robust micron-level alignment of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Photonic packaging is perhaps the most significant bottleneck in the development of commercially relevant integrated photonic devices. This article describes how the key optical, electrical, and thermal requirements of Si-PIC packaging can be met, and what further progress is needed before industrial scale-up can be achieved.

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Section: Introductionmentioning

confidence: 99%

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

et al. 2016

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“…The loss-compensated devices can promote cost-effective optical integrations by engaging ultra-low power optical transmitters and economical receivers in the communication network. In this respect high-gain, erbium-doped waveguide amplifiers are necessary to overcome the signal degradation and realize the future system in package (SiP) solutions [7].…”

Section: Introductionmentioning

confidence: 99%

Doping silica beyond limits with laser plasma for active photonic materials

Chandrappan¹,

Murray²,

Petrik³

et al. 2015

Opt. Mater. Express

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“…There is an increasing need for integrated solutions in optical communications and interconnections applications [1]. In the past few years, a variety of active and passive devices as well as integrated subsystems in CMOS-compatible silicon photonics platforms have been realized [2].…”

Section: Introductionmentioning

confidence: 99%

Subwavelength grating devices in SOI

Wang

Ashrafi

Glesk

et al. 2015

2015 14th International Conference on Optical Communications and Networks (ICOCN)

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Abstract:We demonstrate subwavelength grating devices in silicon-on-insulator including Bragg gratings, racetrack resonators, and optical delay lines. The Bragg grating filter has a 3 dB bandwidth of 0.5 nm and a reflectivity of 90%; the racetrack resonator has a 3 dB bandwidth of 1 nm, a free spectral range of 4.6 nm, and an extinction ratio as high as 33 dB; the optical delay lines achieve ~30ps time-delay with 30% change in duty-cycle.

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Silicon photonics for next generation system integration platform

Cited by 268 publications

References 8 publications

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

Doping silica beyond limits with laser plasma for active photonic materials

Subwavelength grating devices in SOI

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