Microcrystalline silicon ( c-Si:H) thin films were prepared at 300°C on glass. Their structure and transport properties were studied in a wide range of film thickness ranging from 10 nm to 1 m. The crystal fraction increases monotonously from ϳ64% to ϳ100% as film thickness increases. Electron mobility first increases with increasing film thickness at thicknesses smaller than 50 nm but saturates at larger thickness. This mobility behavior is explained by percolation transport through crystalline grains. These results are different from those obtained with preferentially oriented polycrystalline silicon films. It is related to the difference in the microstructure evolution in which subsequent film growth is influenced by the growth surface structure. A single-electron transistor fabricated in 30-nm-thick c-Si:H exhibits Coulomb blockade effects at 4.2 K. This result indicates that amorphous phases which exist between crystalline grains behave as tunnel barrier for electrons.
The complexity of a system, in general, makes it difficult to determine some or almost all matrix elements of its operators. The lack of accuracy acts as a source of randomness for the matrix elements which are also subjected to an external potential due to existing system conditions. The fluctuation of accuracy due to varying system conditions leads to a diffusion of the matrix elements. We show that, for single-well potentials, the diffusion can be described by a common mathematical formulation where system information enters through a single parameter. This further leads to a characterization of physical properties by an infinite range of single-parametric universality classes.
It is shown that a density of states (DOS) proportional to the excitation energy, a so-called polar-like DOS, can arise in odd-parity states, with the superconducting gap vanishing at points even though the spin-orbit interaction for Cooper pairing is strong. Such gap structures are realized in the nonunitary states, F 1u (1, i, 0), F 1u (1, ε, ε 2 ), and F 2u (1, i, 0), classified by Volovik and Gorkov (1985 Sov. Phys.-JETP 61 843). This is due to the gap vanishing in a quadratic manner around a point on the Fermi surface.
Carrier transport properties were investigated for polycrystalline silicon (poly-Si:H:F) films fabricated at 300 °C by 100 MHz plasma enhanced chemical vapor deposition from gaseous mixture of SiF4 and H2. Analysis of free carrier optical absorption (FCA) revealed that 1 μm thick (400) oriented phosphorus-doped poly-Si:H:F films with a carrier concentration of 5×1019 cm−3 had the average electron mobility in crystalline grains at 40 cm2/V s, while the electron mobility of the (220) oriented phosphorus-doped poly-Si:H:F films was only 12 cm2/V s. These results indicated that (400) oriented poly-Si:H:F films had excellent quality crystalline grains. Analyses of the FCA combined with Hall effect current measurements revealed that the electrical conductivity at grain boundaries of top doped films increased as the underlying film thickness increased from 0 to 280 nm for (400) oriented phosphorus-doped/undoped double layered samples, but grain boundaries still acted as large resistive regions limiting the effective conductivity.
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