Oxide thin-film transistors (TFTs) were fabricated using a polycrystalline In-Ga-O (IGO) thin film as the n-channel active layer by direct current magnetron sputtering. The 50-nm-thick IGO TFT showed a field-effect mobility of 39.1 cm 2 V À1 s À1 , a threshold voltage of 1.4 V, and a subthreshold gate voltage swing of 0.12 V/decade. The polycrystalline IGO thin film showed the cubic bixbyite structure of In 2 O 3 without an obvious preferred orientation. The average grain size of polycrystalline IGO was approximately 10 m. The high mobility of IGO TFT is related to the In 2 O 3 crystalline phase and large grain size of the IGO film. #
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The authors developed an ambipolar field-effect transistor (FET) based on an organic-inorganic hybrid structure that consisted of an indium zinc oxide and pentacene double layer fabricated on a SiO2∕n++-Si substrate. Although the FETs based on an indium zinc oxide or pentacene single layer only showed unipolar FET characteristics, the hybrid FET showed definite ambipolar FET characteristics. The authors obtained a highly saturated field-effect hole and electron mobilities of 0.14 and 13.8cm2∕Vs. Furthermore, the authors demonstrated electroluminescence from hybrid FETs using tetracene as an emitting layer. The authors’ success shows that the hybridization of organic and inorganic materials opens up a new field in electronics.
Amorphous indium–gallium–zinc oxide (a-IGZO) films were deposited by DC magnetron sputtering and post-annealed in air at 300–1000 °C for 1 h to investigate the crystallization behavior in detail. X-ray diffraction, electron beam diffraction, and high-resolution electron microscopy revealed that the IGZO films showed an amorphous structure after post-annealing at 300 °C. At 600 °C, the films started to crystallize from the surface with c-axis preferred orientation. At 700–1000 °C, the films totally crystallized into polycrystalline structures, wherein the grains showed c-axis preferred orientation close to the surface and random orientation inside the films. The current–gate voltage (I
d–V
g) characteristics of the IGZO thin-film transistor (TFT) showed that the threshold voltage (V
th) and subthreshold swing decreased markedly after the post-annealing at 300 °C. The TFT using the totally crystallized films also showed the decrease in V
th, whereas the field-effect mobility decreased considerably.
We have developed a high-mobility and high-processability oxide semiconductor using amorphous In2O3–SnO2–ZnO (a-ITZO) as the channel material. An a-ITZO thin-film transistor (TFT) was fabricated by a back-channel-etch process. Its field effect mobility was more than 20 cm2 V-1 s-1 and its subthreshold swing was 0.4 V s-1, which makes it a promising candidate for next-generation TFTs.
Representative transparent conductive oxide films, such as tin-doped indium oxide (ITO) and indium–zinc oxide (IZO) films, were deposited by dc magnetron sputtering using corresponding oxide targets under various total gas pressures (Ptot) ranging from 0.3 to 3.0 Pa. The ITO films deposited at a Ptot lower than 0.7 Pa were polycrystalline and were found to have a large compressive stress of about 1.5 ×109 Pa, whereas the ITO films deposited at 1.5–3.0 Pa were amorphous and had a low tensile stress. In contrast, all the IZO films deposited at a Ptot range of 0.3–3.0 Pa showed an entirely amorphous structure, where the compressive stress in the IZO films deposited at a Ptot lower than 1.5 Pa was lower than that in the ITO films. Such compressive stress was considered to be generated by the atomic peening effect of high-energy neutrals (Ar0) recoiled from the target or high-energy negative ions (O-) accelerated in the cathode sheath toward the film surface.
We investigated the magnetoconductivity Δσ(H)≡1/ρ(H)−1/ρ(0) in a wide range of magnetic fields for three-dimensional indium oxide films doped with zinc, tin, or gallium in the range of resistivity ρ(300K) between 4.1×10−6 Ωm and 1.7×10−3 Ωm. The weak localization theory was fitted to data for Δσ(H) at various temperatures in the range 2.0 K≤T≤50 K by the use of suitable characteristics Dτin(T) and Dτso, where D, τin, and τso are the electron diffusion constant, inelastic scattering time, and spin-orbit (s-o) scattering time, respectively. It was found that (i) for films with a large value of ρ, the sign of Δσ(H) changes from positive to negative with decreasing temperature as a precursor to an anti-weak localization effect; (ii) the ratio τso/τin decreases from ≈4000 to≈4.0 with increasing ρ; (iii) the strong ρ dependence of Dτso cannot be explained by the model with a constant atomic number Z in a formula τso∝1/Z4 proposed by Abrikozov and Gorkov Zh. Eksp. Teor. Fiz. 42, 1088 (1962); [Sov. Phys. JETP 15, 752 (1962)]. As a reason for this ρ dependence, we suggest that the s-o scattering changes with increasing ρ from light oxygen atoms to heavy atoms, i.e., indium, zinc, and gallium, because of the decrease in the number of oxygen vacancies acting as s-o scattering centers.
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