We present the science and technology roadmap for graphene, related two-dimensional crystals, and hybrid systems, targeting an evolution in technology, that might lead to impacts and benefits reaching into most areas of society. This roadmap was developed within the framework of the European Graphene Flagship and outlines the main targets and research areas as best understood at the start of this ambitious project. We provide an overview of the key aspects of graphene and related materials (GRMs), ranging from fundamental research challenges to a variety of applications in a large number of sectors, highlighting the steps necessary to take GRMs from a state of raw potential to a point where they might revolutionize multiple industries. We also define an extensive list of acronyms in an effort to standardize the nomenclature in this emerging field.
Second-generation quantum-well sensors for room-temperature scanning Hall probe microscopy J. Appl. Phys. 97, 096105 (2005); 10.1063/1.1887828 Nanometer-scale two-terminal semiconductor memory operating at room temperature Appl. Phys. Lett. 86, 042106 (2005); 10.1063/1.1852711 Formation and optical properties of InAs/GaAs quantum dots for applications as infrared photodetectors operating at room temperature Appl. Phys. Lett. 82, 553 (2003); 10.1063/1.1540733The effect of strain in InP/InGaAs quantum-well infrared photodetectors on the operating wavelength
Abstract-In this paper, the intermodulation distortion (IMD) behavior of LDMOS transistors is treated. First, an analysis is performed to explain measured IMD characteristics in different classes of operation. It is shown that the turn-on region plays an important role in explaining measured IMD behavior, which may also give a clue to the excellent linearity of LDMOS transistors. Thereafter, with this knowledge, a new empirical large-signal model with improved capability of predicting IMD in LDMOS amplifiers is presented. The model is verified against various measurements at low as well as high frequency in a class-AB power amplifier circuit.
The measurement accuracy of an ultra-wideband time domain microwave tomography system is investigated. In order to make an assessment of the random variation of the measurements, the measurement repeatability of the system is evaluated by comparison with an ultra-wideband frequency domain system. A phantom is imaged with the time domain microwave tomography system and the reconstructed images are compared to those obtained by using the frequency domain system. The results suggest that with averaging tens of measurements, the time domain system can achieve the same level of measurement repeatability as that of the frequency domain system in the interesting frequency range of microwave tomography. The imaging results, however, indicate that the phantom reconstruction does not require such high measurement accuracy. The permittivity profile of the phantom reconstructed from the non-averaging time domain measurements is very similar to that obtained by means of the frequency domain system.
In this paper, a time-domain system dedicated to medical diagnostics has been designed, a prototype has been built and its performance has been evaluated. Measurements show that the system has a 3-dB bandwith of about 3.5 GHz and a signal to noise ratio over 40 dB in the frequency range about 800 MHz to 3.8 GHz. The system has been used to perform a microwave tomographic image reconstruction test. The same target was reconstructed based on data measured with a network analyzer.A comparison between the images shows very small differences, and proves the functionality of the time domain system. Index Terms-Microwave imaging, time domain measurements, ultrawideband (UWB).
Integration of a 140-GHz packaged lowtemperature cofired ceramic (LTCC) antenna with a power detector is demonstrated under the concept of antenna-inpackage. The detector is designed on an indium phosphide (InP) process. A grid array antenna in LTCC is designed to provide package for the detector. Coplanar ground-signal-ground (GSG) bond wires are used to connect the detector and the antenna. Parallel plate mode is observed in the InP substrate and absorbed by the LTCC substrate. The comparison between the measured responsivity of the power detector with and without the antenna indicates the acceptable insertion loss of the coplanar GSG bond wires transition. It shows a feasible solution for the D-band front-end integration and packaging. Index Terms-Antenna-in-package (AiP), grid array antenna (GAA), low-temperature cofired ceramic (LTCC), parallel plate mode (PPM).
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