The phase diagram of the Au-In-Sb ternary system is of importance in predicting the interface reaction between In-based solders and the Au substrate. Using the calculated phase diagram method and based on experimental data of thermodynamic properties and phase boundaries, the Au-Sb binary system was assessed, and the In-Sb binary system was revised. On the basis of the constituent binary systems, Au-Sb, In-Sb, and Au-In, the Au-In-Sb ternary system was modeled. Several isothermal and vertical sections were calculated, among which the one at 500 K reproduces the experimental diagram well.

The phase diagram of the Au-In-Sn system is of importance in developing materials of high performance in electronic packaging as well as in simulating the interfacial reaction between Sn-In and Au. By using the calculation of phase diagram (CALPHAD) method, phase equilibria in the Au-Sn binary system has been optimized based on experimental thermodynamic property and recently renewed phase boundaries. Combined with two binary systems, Au-In and In-Sn, in addition to the reported experimental isothermal section of the Au-In-Sn system, the Au-In-Sn ternary system has been modeled, and three isothermal sections at 300 K, 500 K, and 700 K and three vertical sections, Au-In 0.2 Sn 0.8 , Au-In 0.5 Sn 0.5 , and Au-In 0.7 Sn 0.3 , of the Au-In-Sn ternary system have been further calculated.

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Interfacial reactions between Sn-Bi alloys of different compositions and Ni substrates at 423 K for different durations were investigated. Only one interfacial phase, Ni 3 Sn 4 , was detected despite the existence of several other intermetallic compounds (IMCs) in Ni-Sn and Ni-Bi binary systems. This observation (only Ni 3 Sn 4 was formed at the interface) was explained as a combination of the driving force for formation of the IMC and diffusion of Ni. The change of Ni 3 Sn 4 layer thickness as a function of annealing time, which obeys a parabolic rule, was further confirmed. The thickness of Ni 3 Sn 4 was also found to decrease with increasing Bi content in the Sn-Bi alloy.