Thermodynamic modeling of the Au-In-Sn system

Liu, H. S.; Liu, C. L.; Ishida, K.; Jin, Zhanpeng

doi:10.1007/s11664-003-0025-2

Cited by 70 publications

(33 citation statements)

References 23 publications

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“…[1][2][3][4] On the other hand, the Au/Ni/Cu layers as under-bump metallurgy (UBM) layers have been commonly employed in electronic packaging. [5][6][7][8][9][10] Reliability of soldering joints can be affected by interfacial reaction between solder and UBM layers during soldering as well as subsequent service. [5][6][7][8] Thermodynamic properties and phase equilibria of the related systems involving Sn-based alloys and UBM metals are helpful to predict the evolution of interfacial microstructure during soldering and subsequent service of electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic Modeling of the Au-Bi-Sb Ternary System

Wang

Meng

Liu

et al. 2007

Journal of Elec Materi

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Based on the available experimental information, the Au-Bi binary system has been thermodynamically assessed using the CALPHAD method. The solution phases, including liquid, fcc_A1, and rhombohedral_A7, were modeled as substitutional solutions, while the intermediate compound Au 2 Bi was described as a stoichiometric compound. Combined with the available thermodynamic parameters of the Au-Sb and Bi-Sb binary systems, a thermodynamic description of the Au-Bi-Sb ternary system has been developed to reproduce the reported phase equilibria. The liquidus projection and several vertical and isothermal sections of this ternary system have been calculated, which are in reasonable agreement with the reported experimental data.

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Section: Introductionmentioning

confidence: 99%

Thermodynamic Modeling of the Au-Bi-Sb Ternary System

Wang

Meng

Liu

et al. 2007

Journal of Elec Materi

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“…Moreover, we obtained from other works the thermodynamic parameters of Au-In, Au-Sn, and In-Sn binary systems that also constitute the ternary Au-In-Sn system. [17][18][19][20] The Sn-rich corner of the ternary Au-In-Sn phase diagrams calculated at 500 K, 400 K, and 300 K are shown in Fig. 4a, b, and c, respectively.…”

Section: Resultsmentioning

confidence: 99%

Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering

Seo

Cho

Lee

et al. 2006

J. Electron. Mater.

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We chose Sn-2.8Ag-20In and Sn-10Bi-10In (numbers are in weight percentages unless specified otherwise) as Pb-free solder materials for intermediate-step soldering. We then investigated how the two solders reacted with the under bump metallurgy (UBM) of Au/Ni (Au: 1.5 mm and Ni: 3 mm) at 210°C, 220°C, 230°C, and 240°C for up to 4 min. All of the Au UBM was dissolved into the solder matrix as soon as the interfacial reaction started. The reaction formed Au(In,Sn) 2 in the case of SnAgIn, and it formed Au(Sn,In) 4 and Au(In,Sn) 2 in the case of SnBiIn. The formation mechanism of the intermetallic phases is explained thermodynamically. The exposed Ni layer reacted with the solder and formed Ni 28 Sn 55 In 17 in case of SnAgIn, and formed Ni 3 (Sn,In) 4 in case of SnBiIn, at the solder joint interface. Under the same soldering conditions, the Ni 3 (Sn,In) 4 layer in the SnBiIn/UBM is thicker than the Ni 28 Sn 55 In 17 layer in the SnAgIn/UBM. Because of the thicker intermetallic compound layer, the SnBiIn solder joint has weaker shear strength than the SnAgIn solder joint.

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“…Both experimental and thermodynamic modeling results are usually available for most of the binary solder-related phase diagrams; however, information regarding the ternary and higherordersystemsisrelativelylimited.Experimentalphaseequilibriummeasurementsareavailable for Sn-Ag-Au [19][20][21][22], Sn-Ag-Cu [23][24][25][26][27], Sn-Ag-Ni [28], Sn-Bi-Au [29], Sn-Bi-Ag [30,31], Sn-Bi-Cu [32], Sn-Bi-Fe [33], Sn-Bi-Ni [34], Sn-Cu-Au [35], Sn-Cu-Ni [36,37], Sn-In-Au [38], Sn-In-Cu [39], Sn-In-Ag [40], Sn-In-Ni [41], Sn-Sb-Ag [12,[42][43][44], Sn-Sb-Au [45], Sn-Zn-Ag [46], Sn-Zn-Bi [47], and Sn-Zn-Cu [48], and Sn-Ag-Cu-Ni [49,50] systems. As for lead-free soldering, there are some commercial thermodynamics databases, such as COST531 database [51], NIST solder database [52] and ADAMIS database [53].…”

Section: Phase Diagrams Of Pb-free Solder Systemsmentioning

confidence: 99%

Phase Diagrams and Their Applications in Pb‐Free Soldering

Chen

Gierlotka

et al. 2012

Lead‐Free Solders: Materials Reliability for Electronics

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Pb-free soldering is one of the most important technologies in the electronics industry. A phase diagram is a comprehensive representation of thermodynamic properties of a multicomponent material system. Basic knowledge and information of phase diagrams of Pb-free solder systems are reviewed. In this chapter, several examples of applications of phase diagrams in Pb-free soldering are presented, including general applications of melting, solidification and intermetallic compounds (IMC) formation caused by interfacial reactions. With the aid of phase diagrams, interpretations of some abnormal phenomena in Pb-free soldering such as effective undercooling reduction by Co doping, unexpected IMC growth rate in Sn-Bi/Fe couples, unexpected solder melting in Sn-Sb/Ag joints, special up-hill diffusion in the Cu/Sn-Cu/Ni sandwich structure, and the influence of limited Sn supply upon the interfacial reactions in the Au/Sn/Cu sandwich specimens, and so on, will be given.

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Thermodynamic modeling of the Au-In-Sn system

Cited by 70 publications

References 23 publications

Thermodynamic Modeling of the Au-Bi-Sb Ternary System

Thermodynamic Modeling of the Au-Bi-Sb Ternary System

Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering

Phase Diagrams and Their Applications in Pb‐Free Soldering

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