Interfacial reaction between Sn-Bi alloy and Ni substrate

Wang, J.; Liu, H. S.; Liu, L. B.; Jin, Zhanpeng

doi:10.1007/s11664-006-0166-1

Cited by 27 publications

(10 citation statements)

References 21 publications

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“…The results obtained in this study were in accordance with the Sn-58Bi/Ni system. 18 The Ni layer remained in all the SB/Au/Ni/SUS304 couples, demonstrating that this layer acted as an excellent barrier between the solder and the substrate. Figure 2 shows the linear relationship between the IMC thickness and the square root of reaction time in all the SB/Au/Ni/SUS304 couples reacted at three reaction temperatures, for different reaction times.…”

Section: Resultsmentioning

confidence: 92%

Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

Yen

Liaw

Chen

et al. 2010

Journal of Elec Materi

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The liquid/solid interfacial reactions of Sn-58Bi (SB) and Sn-9Zn (SZ) lead-free solders with Au/Ni/SUS304 multilayer substrates have been investigated in this study. In the SB/Au/Ni/SUS304 couple, only the Ni 3 Sn 4 phase with needle-like grains was formed at the SB/Au/Ni/SUS304 interface. The Ni 5 Zn 21 phase with a column structure was formed at the SZ/Au/Ni/SUS304 interface. The thickness of both intermetallic compounds (IMCs) increased with increasing reaction temperature and time. Meanwhile, the growth mechanism of these two IMCs is seen to follow a parabolic law and is diffusion controlled.

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Section: Resultsmentioning

confidence: 92%

Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

Yen

Liaw

Chen

et al. 2010

Journal of Elec Materi

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“…According to Ref. [15], during liquid aging, Sn participated from solder matrices and reacted with Cu to form IMC phase, so that a composition gradient of Bi element formed against the interface in the molten solder. Therefore, fine Bi-rich particles formed in the solidification process after the liquid aging.…”

Section: Methodsmentioning

confidence: 99%

Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging

Shen

Peng

Zhao

et al. 2011

J Mater Sci: Mater Electron

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Ag nano-particle reinforced Sn30Bi0.5Cu-xAg (x = 1 wt%, 2 wt% and 5 wt%) solder pastes were prepared and reflowed on Cu substrates at 523 K. Then, the solder joints were liquid aged at 473 K for 6 and 12 h. Microstructural evolutions of these solder joints were observed by scanning electron microscopy (SEM). The results show that Bi-rich phase was refined in the as-reflowed Sn30Bi0.5Cu-xAg composite solder matrices. With the increase of the liquid aging time, Bi-rich phase was refined both in the Sn30Bi0.5Cu solder and in the Sn30Bi0.5Cu-xAg composite solders. The addition of Ag nano-particles changed the growth rate of the IMC layers during liquid aging due to the absorption effect of the Ag 3 Sn micro-particles.

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“…[3][4][5][6][7][8] Among them, Sn-Bi alloys are attractive as solder alloys due to their low melting temperature, low cost, and good mechanical properties, such as tensile strength and creep resistance, compared with Sn-Pb alloy. [9][10][11] In particular, Sn-58 wt.%Bi alloy with eutectic composition has low melting temperature of 138°C, showing that it is possible to reflow at low processing temperature. 12 Low-temperature soldering is necessary because electronic devices are prone to thermal damage during high-temperature reflow processing, which damages not only the solder joints but also the printed circuit board (PCB) and components.…”

Section: Introductionmentioning

confidence: 99%

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Myung

Kim

et al. 2016

Journal of Elec Materi

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The influence of two kinds of surface finish, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the interfacial reactions and drop reliability of epoxy-enhanced Sn-58 wt.%Bi solder has been investigated after temperature-humidity storage tests. The chemical composition and morphology of intermetallic compounds (IMCs) were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and electron probe microanalysis. Also, the mechanical reliability of solder joints was evaluated using board-level drop tests. The Sn-Bi epoxy solder/ENEPIG joint exhibited higher IMC growth rate than the Sn-Bi epoxy solder/ENIG joint. After 500 h at 85°C/ 85% RH storage condition, new IMCs were formed on the Ni 3 Sn 4 layer in samples with both surface finishes. The results of board-level drop tests showed that the number of drops was higher for the ENIG than the ENEPIG surface finish. Solder joint fracture occurred along the interface between the solder and IMC layer for the ENIG surface finish. However, with the ENEPIG surface finish, the crack propagated between the IMCs.

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Interfacial reaction between Sn-Bi alloy and Ni substrate

Cited by 27 publications

References 21 publications

Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

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