Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging

Shen, Jun; Peng, Changfei; Zhao, Mali; Wu, Cuiying

doi:10.1007/s10854-011-0606-4

Cited by 9 publications

(2 citation statements)

References 15 publications

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“…7), the increasing layer thickness with decreasing silver content can be explained by the following. The Ag 3 Sn intermetallic compounds can adsorb on the surface of the Cu 6 Sn 5 intermetallic layer, and they can obstruct the growing of that layer in agreement with [24,25]. If the silver content in the solder is higher -especially in the case of alloys with hypereutectic silver compositions (>2.7 wt%) -more Ag 3 Sn IMC can adsorb and thus lower intermetallic layer can form.…”

Section: Discussionmentioning

confidence: 99%

Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

Krammer

Garami

Horváth

et al. 2015

Journal of Alloys and Compounds

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Section: Discussionmentioning

confidence: 99%

Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

Krammer

Garami

Horváth

et al. 2015

Journal of Alloys and Compounds

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“…Studies have shown that the development of composite lead-free solders by mechanically adding micro/nano-sized particles into Sn-based lead-free solder matrices enhances their wettability and mechanical properties [17]. Metallic micro/nano-sized alloys of elements such as silver, copper, nickel, antimony, and bismuth improve the mechanical properties of a lead-free solder, and simultaneously reduce the melting point.…”

Section: Introductionmentioning

confidence: 99%

Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates

Fouzder

Chan

Chan³

2014

J Mater Sci: Mater Electron

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Nano-sized, non-reacting, non-coarsening CeO 2 particles with a density close to that of solder alloy were incorporated into Sn-3.0 wt%Ag-0.5 wt%Cu solder paste. The interfacial microstructure and hardness of Ag surfacefinished Cu substrates were investigated, as a function of reaction time, at various temperatures. After the initial reaction, an island-shaped Cu 6 Sn 5 intermetallic compound (IMC) layer was clearly observed at the interfaces of the SnAg-Cu based solders/immersion Ag plated Cu substrates. However, after a prolonged reaction, a very thin, firmly adhering Cu 3 Sn IMC layer was observed between the Cu 6 Sn 5 IMC layer and the substrates. Rod-like Ag 3 Sn IMC particles were also clearly observed at the interfaces. At the interfaces of the Sn-Ag-Cu based solder-Ag/Ni metallized Cu substrates, a (Cu, Ni)-Sn IMC layer was found. Rod-like Ag 3 Sn and needle-shaped Cu 6 Sn 5 IMC particles were also observed on the top surface of the (Cu, Ni)-Sn IMC layer. As the temperature and reaction time increased, so did the thickness of the IMC layers. In the solder ball region of both systems, a fine microstructure of Ag 3 Sn, Cu 6 Sn 5 IMC particles appeared in the b-Sn matrix. However, the growth behavior of the IMC layers of composite solder doped with CeO 2 nanoparticles was inhibited, due to an accumulation of surface-active CeO 2 nanoparticles at the grain boundary or in the IMC layers. In addition, the composite solder joint doped with CeO 2 nanoparticles had a higher hardness value than the plain Sn-Ag-Cu solder joints, due to a well-controlled fine microstructure and uniformly distributed CeO 2 nanoparticles. After 5 min of reaction on immersion Agplated Cu substrates at 250°C, the micro-hardness values of the plain Sn-Ag-Cu solder joint and the composite solder joints containing 1 wt% of CeO 2 nanoparticles were approximately 16.6 and 18.6 Hv, respectively. However after 30 min of reaction, the hardness values were approximately 14.4 and 16.6 Hv, while the micro-hardness values of the plain Sn-Ag-Cu solder joints and the composite solder joints on Ag/Ni metallized Cu substrates after 5 min of reaction at 250°C were approximately 15.9 and 17.4 Hv, respectively. After 30 min of reaction, values of approximately 14.4 and 15.5 Hv were recorded.

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Effects of Ag particles content on properties of Sn0.7Cu solder

Yang

2012

J Mater Sci: Mater Electron

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Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging

Cited by 9 publications

References 15 publications

Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates

Effects of Ag particles content on properties of Sn0.7Cu solder

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