Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

Krammer, Olivér; Garami, Tamas; Horváth, Barbara; Hurtony, Tamás; Medgyes, Bálint; Jakab, László

doi:10.1016/j.jallcom.2015.02.092

Cited by 42 publications

(17 citation statements)

References 27 publications

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“…As the XRD result in Figure a shows, SnAgCu305 solder consists of three phases, Sn‐rich phase, CuSn IMCs and Ag 3 Sn IMCs, which is also reported in other literatures . Micro galvanic cells may be formed between Sn‐rich phase and CuSn IMCs, Ag 3 Sn IMCs due to the large electromotive force difference between Sn and CuSn, Ag 3 Sn.…”

Section: Resultssupporting

confidence: 72%

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Liu

et al. 2017

Materials & Corrosion

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The corrosion characteristics of Sn‐3.0Ag‐0.5Cu solder under polyvinyl chloride (PVC) and polyethylene (PE) fire smoke atmospheres were investigated by weight loss method and surface characterization techniques. The corrosion kinetics results of 15‐day tests show that the mass loss of Sn‐3.0Ag‐0.5Cu solder in PE smoke is much lower than that in PVC smoke. The former shows no significant variation during the test. In contrast, the latter increases rapidly first and then presents a slow exponential increase. Microstructure analysis indicates that no obvious corrosion product appeared in PE smoke. Nevertheless, the corrosion products in PVC smoke grow larger first and then become smaller and denser. The possible growth process of corrosion products is that grain growth dominates the formation of the corrosion products at the initial stage and then the nucleation process is predominant. Furthermore, the corrosion mechanisms of Sn‐3.0Ag‐0.5Cu solder in the different fire smoke are also analyzed. Stannous oxide and stannic oxide are regarded as the corrosion products under both PE and PVC smoke atmospheres, while Sn21Cl16(OH)14O6 is only observed under PVC smoke atmosphere.

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Section: Resultssupporting

confidence: 72%

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Liu

et al. 2017

Materials & Corrosion

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“…7b, due to falling out from the sample during the polishing. IMCs is relatively lower compared to the classical SAC305 or SAC405, but their dispersion around the grain boundaries of the Sn grains is usually even [12]. The presence of the Ag3Sn at the Sn grain boundaries can decrease the grain-boundary diffusion which results in larger grains and lower number of the grain boundaries.…”

Section: Resultsmentioning

confidence: 96%

Characterization of Tin Pest Phenomenon in a Low Ag Content SAC Solder Alloy

Illés

Skwarek

Hurtony

et al. 2019

2019 22nd European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC)

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In the electronics technology, the metallic β-Sn (white tin) is the basic material of solder alloys and surface finishes. The "tin pest" phenomenon is the spontaneous allotropic transition of ß-Sn to the semiconductor α-Sn (gray tin) under the temperature of 13.2°C. In this work, the tin pest susceptibility of the widely used Sn99Ag0.3Cu0.7 solder alloy was investigated and compared to Sn99Cu1 alloy (as a well know reference). Bulk solder bars were prepared by metal casting and the samples were inoculated by InSb, CdTe and α-Sn powders to enhance the allotropic transition process. The inoculator materials were pressed onto the surfaces of the samples by a mechanic lamination. The samples were stored at-10 °C temperature for 8 weeks. The allotropic transition was monitored by optical inspection and by electrical resistance measurements. The microstructural changes of the samples-caused by the transition of crystal structure of Sn-were investigated by metallurgical cross-sections. The results showed, that in all cases the Sn99Ag0.3Cu0.7 solder alloy is much less susceptible to tin pest development than the Sn991Cu, which might be explained by the suppression effect of the Ag alloying. Furthermore, it was found that the process of transition highly depends on the applied inoculator material.

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“…Comparative analyses were also performed in another research concerning various lead-free SAC (Sn96.5Ag3Cu0.5, Sn95.5Ag4Cu0.5) and two types of micro-alloyed SAC (SnAgCu+Bi+Sb) solder alloys from the viewpoint of thermomechanical properties and formation of intermetallic layers [23]. A test board was designed containing 0603 size resistors, and the samples were soldered with vapor phase soldering [24] in the experiment.…”

Section: Micro-and Nanoscale Materials Characterizationsmentioning

confidence: 99%

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2015

Vajk¹,

Harsányi

Poppe

et al. 2016

Period. Polytech. Elec. Eng. Comp. Sci.

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PrefaceThroughout László Vajta, Dean of BME VIK János Levendovszky, Deputy Dean of BME VIK Department of Automation and Applied InformaticsDepartment of Automation and Applied Informatics (AUT) is one of the largest and dynamically developing departments at BME with diverse scope competences such as control theory, embedded systems, software modelling, applied software development, Internet of Things, power electronics, mechatronics, and many others. The department's main activities are education, research and development. Training versatile electrical and software engineers with solid practical knowledge is our top priority. Our profile also includes developing high quality software and hardware solutions for industry partners. All of our activities are backed by strong research background.In 2015, the department has organized the 21 st European Wireless (EW) Conference. The EW 2015 conference hosted more than 140 participants from 30 different countries. The 2015 edition of EW was aimed at addressing a key theme on "5G and beyond."The next sections summarize the key research results of the department in year 2015. IoT and Smart CityThe Internet of Things (IoT) is transforming the surrounding physical objects into an ecosystem of information that enriches our everyday life. The IoT represents the convergence of advances in miniaturization, wireless connectivity, and increased data storage, and is driven by various sensors. Application and service development methods and frameworks are required to support the realization of solutions covering data collection, transmission, data processing, analysis, reporting, and advanced querying. Our SensorHUB framework URBMOBI is a mobile environmental sensor that (i) provides temporally and spatially distributed environmental data, (ii) fulfills the need for monitoring at various places without the costs for a large number of fixed measurement stations, (iii) integrates small and precise sensors in a system that can be operated on buses, trams, or other vehicles, (iv) concentrates on urban heat and thermal comfort, and (v) aims at providing climate services and integration with real-time climate models.utilizes the state-of-the-art open source technologies and provides a unified tool chain for IoT related application and ser-URBMOBI project has been worked out between 2013 and 2015 by the following consortium: RWTH Aachen University (Germany), Netherlands Organization for Applied Scientific Research TNO (Netherlands), ARIA Technologies (France), Budapest University of Technology and Economics (Hungary), and Meteorological and Environmental Earth Observation (Italy).The SOLSUN (Sustainable Outdoor Lighting & Sensory Urban Networks) project is about to demonstrate how intelligent city infrastructure can be created in a cost-effective and sustainable way by reusing existing street lighting as the communications backbone. We apply different technologies and methods to reduce energy consumption at the same time as turning streetlights into nodes on a scalable network that is al...

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Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

Cited by 42 publications

References 27 publications

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Characterization of Tin Pest Phenomenon in a Low Ag Content SAC Solder Alloy

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2015

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