Thermodynamic modeling of the Au-In-Sb ternary system

Abstract

The phase diagram of the Au-In-Sb ternary system is of importance in predicting the interface reaction between In-based solders and the Au substrate. Using the calculated phase diagram method and based on experimental data of thermodynamic properties and phase boundaries, the Au-Sb binary system was assessed, and the In-Sb binary system was revised. On the basis of the constituent binary systems, Au-Sb, In-Sb, and Au-In, the Au-In-Sb ternary system was modeled. Several isothermal and vertical sections were calculated, among which the one at 500 K reproduces the experimental diagram well.

Thermodynamic Modeling of the Au-Bi-Sb Ternary System

“…ðjÞ L / Au;Sb and ðjÞ L / Bi;Sb are binary interaction parameters, which are taken directly from the Au-Sb and Bi-Sb systems assessed by Liu et al 9 and Ohtani et al, 11 respectively. The ternary …”

“…[1][2][3][4] On the other hand, the Au/Ni/Cu layers as under-bump metallurgy (UBM) layers have been commonly employed in electronic packaging. [5][6][7][8][9][10] Reliability of soldering joints can be affected by interfacial reaction between solder and UBM layers during soldering as well as subsequent service. [5][6][7][8] Thermodynamic properties and phase equilibria of the related systems involving Sn-based alloys and UBM metals are helpful to predict the evolution of interfacial microstructure during soldering and subsequent service of electronic devices.…”

“…Among the three binary systems, the Au-Sb and Bi-Sb binary systems have been well assessed thermodynamically by Liu et al 9 and Ohtani et al, 11 respectively. Thermodynamic parameters of various phases in the Au-Sb and Bi-Sb binary systems optimized by Liu et al 9 and Ohtani et al 11 were directly adopted in the present work.…”

“…Thermodynamic parameters of various phases in the Au-Sb and Bi-Sb binary systems optimized by Liu et al 9 and Ohtani et al 11 were directly adopted in the present work. Figures 1 and 2 showed the calculated phase diagrams of the Au-Sb and Bi-Sb binary systems, respectively.…”

10.5937/mmeb1402117k = Lead-free alloys for ecological solders manufacturing

“…The most attractive world lead-free alloys are so-called SAC alloys (Sn-Ag-Cu) [5]. This alloy is recommended for used by NEMI (National electronic Manufacturing Initiative) as possible replacement for leadtin solder.…”