Microstructure evolution and mechanical reliability of Cu/Au–Sn/Cu joints during transient liquid phase bonding

Peng, Jian; Liu, H. S.; B., H.; Shi, Xichang; Wang, R. C.

doi:10.1007/s10853-018-2204-9

Cited by 29 publications

(10 citation statements)

References 25 publications

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“…Some rock sugar-like fractures can also be seen in Figure 10E. Moreover, fractures were observed across the Cu 7 In 3 phase, showing a combination of inter-granular and trans-granular fractures, which is similar to the result in Cu/Au-Sn/Cu system (Peng et al, 2018). As holding time reached 150 min,…”

Section: Effect Of Holding Timesupporting

confidence: 72%

Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints

et al. 2021

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Transient liquid phase sintering (TLPS) is a promising joining technology that can achieve high temperature resistant solder joints at low temperature, showing excellent potential in power electronics. In this work, Cu/Cu-In/Cu solder joints were successfully prepared by TLPS process. The effects of bonding pressure and holding time on the microstructure and shear strength of Cu-In TLPS joints at 260 and 320°C were studied. The results showed that as bonding pressure increased from 0.1–0.6 MPa, the porosity decreased and shear strength increased significantly. No obvious change was found as bonding pressure continued to increase to 1 MPa. As holding time increased at 260°C, Cu11In9 was formed and gradually transformed to Cu2In that can withstand elevated temperature. Meanwhile, the porosity decreased while shear strength increased. It was calculated that volume expansion (12.74%) occurred during the phase transition from Cu11In9 to Cu2In. When bonding temperature increased to 320°C, only Cu2In was detected and then gradually transformed to Cu7In3 with the growing holding time. As holding time reached 120 min, their porosity increased and lead to weak shear strength due to volume shrinkage (15.43%) during the phase transition from Cu2In to Cu7In3.

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Section: Effect Of Holding Timesupporting

confidence: 72%

Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints

et al. 2021

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“…Sn/Cu, 9096) Sn/Ni, 95,96) Sn/Ag, 9799) In/Ag 100) and In/Au 100) have been reported as structures of TLP joint (interlayer/substrate or metallization). A combination of solder alloy/substrate such as SnAu/Cu, 101,102) SnAu/ Ni, 103) SnBi/Cu, 104) SnCu/Cu, 105) and SnAg/Cu 106) has also been reported. In the case of Cu/Sn-based solder, there is a problem that voids are formed at the interface between the Sn-based solder and Cu substrate.…”

Section: Tlp Materialsmentioning

confidence: 99%

Recent Development of Joining and Conductive Materials for Electronic Components

Kobayashi

Ando

2021

Mater. Trans.

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This study introduces research trends in the electronics materials, such as joining materials including high-temperature lead-free solder, sintered materials using metal particles and transient liquid phase (TLP) materials, and conductive materials such as aluminum and copper alloys. These studies include the content of the special issue published in Materials Transactions (Vol. 57, No. 6 and Vol. 60,No. 6) entitled Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials. It also introduces interesting research contents, leading the development of next-generation electronics.

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“…Au-Au thermal compression bonding at a lower temperature is achieved by smoothing the Au surface at the atomic level [18], which is very complex. Among those vacuum packaging technologies, the liquidus of eutectic solder is the same as the solidus and thus eutectic bonding is chosen as the vacuum packaging technology of the physics package for its relatively low bonding temperature, outstanding fatigue and creep resistance, superior corrosion resistance and low leakage [19][20][21][22]. Kuhmann et al studied the oxidation and reduction kinetics of different eutectic solders [23].…”

Section: Introductionmentioning

confidence: 99%

High Vacuum Packaging of MEMS Devices Containing Heterogeneous Discrete Components

Guo

Meng²,

Dan

et al. 2021

Applied Sciences

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Vacuum packaging of Micro-electro-mechanical system (MEMS) devices is a hot topic for its advantages of improving performance and reducing power consumption. In this paper, the physics package of a chip scale atomic clock (CSAC), as a typical kind of MEMS device, is performed by vacuum packaging based on a systematic method proposed by us. The whole process, including low outgassing and thermal stable materials selection, prebaking for desorption, getter firing for absorption and solder reflow for vacuum sealing is introduced thoroughly. The thermogravimetric analysis or thermal gravimetric analysis (TGA) is used to analyze the thermal stability and desorption of materials. The leak rate of physics packages is measured to be less than 4 × 10−10 Pa·m3/s by helium leak detection. The residual gas pressure and composition in physics packages are analyzed after vacuum packaging. The results show a high vacuum ~0.1 Pa in the physics package. The frequency stability is improved from 4.68 × 10−11 to 1.07 × 10−11 @40,000 s. The presented method for high vacuum packaging is also applicable to other MEMS devices.

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Microstructure evolution and mechanical reliability of Cu/Au–Sn/Cu joints during transient liquid phase bonding

Cited by 29 publications

References 25 publications

Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints

Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints

Recent Development of Joining and Conductive Materials for Electronic Components

High Vacuum Packaging of MEMS Devices Containing Heterogeneous Discrete Components

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