Recent Development of Joining and Conductive Materials for Electronic Components

Kobayashi, Tatsuya; Ando, Tetsuya

doi:10.2320/matertrans.mt-m2021060

Cited by 11 publications

(4 citation statements)

References 130 publications

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“…Gold-based alloys, such as Au-Sn, Au-Sb, and Au-Ge eutectic alloys, are recognized for their exceptional corrosion resistance, high electrical and mechanical strength, and superior thermal conductivity. These attributes render them highly advantageous for electronic packaging applications [4][5][6][7][8]. Au-Ge-based alloys have especially attracted much attention as high-temperature Pb-free solders [4,9].…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic Modeling of the Au-Ge-X (X = In, Sb, Si, Zn) Ternary Systems

Bai,

Tong,

Rong

et al. 2024

Materials

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In this study, the CALPHAD approach was employed to model the thermodynamics of the Au-Ge-X (X = In, Sb, Si, Zn) ternary systems, leveraging experimental phase equilibria data and previous assessments of related binary subsystems. The solution phases were modeled as substitutional solutions, and their excess Gibbs energies were expressed using the Redlich–Kister polynomial. Owing to the unavailability of experimental data, the solubility of the third elements in the Au-In, Au-Sb, and Au-Zn binary intermetallic compounds was excluded from consideration. Additionally, stable ternary intermetallic compounds were not reported in the literature and, thus, were not taken into account in the present thermodynamic calculations. Calculations of liquidus projections, isothermal sections, and vertical sections for these ternary systems have been performed, aligning with existing experimental findings. These thermodynamic parameters form a vital basis for creating a comprehensive thermodynamic database for Au-Ge-based alloys, which is essential for the design and development of new high-temperature Pb-free solders.

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Section: Introductionmentioning

confidence: 99%

Thermodynamic Modeling of the Au-Ge-X (X = In, Sb, Si, Zn) Ternary Systems

Bai,

Tong,

Rong

et al. 2024

Materials

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“…Wiring formation technology by electroplating in the electronics field is rapidly advancing to achieve higher functionality and density in electronic devices [1]. Cu plating and Ni plating are widely used to form wiring and electrode pads on semiconductor devices and substrates.…”

Section: Introductionmentioning

confidence: 99%

Effect of Plating Potential on Three-Dimensional Structural Plating Films and their Adhesion to Epoxy Resin

Kobayashi,

Pham,

Shohji

2023

KEM

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This study investigated the electrochemical behavior of Ni–Cu alloy plating baths during plating and dealloying reactions. Furthermore, the potential and plating time effects on the shape of three-dimensional structural Ni–Cu alloy plating film and its adhesion to epoxy resin were investigated. Nodules were observed on the surface of the plating film generated at potentials from-0.5 V to-1.0 V. When the plating films formed at potentials of-1.0 V to-1.5 V were dealloyed, the formation of pores was observed. The shear test results showed that the average shear strength of the specimen joined with epoxy resin between two Cu plates with Ni–Cu alloy plating film formed at a potential of-1.0 V was the highest under all conditions.

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“…Thus, many researches have been actively conducted to improve the performance of electronic materials used in packaging, such as solder and sealing materials, and to develop new bonding methods for semiconductors. 3) The surface treatment of the electrode, which forms the interface with the bonding material such as solder, is also an important technical element to improve the bonding reliability. Thus, there is a need to further improvement of the performance of electroless Ni plating, multi-layer plating including a Ni layer, and alloy plating, which are currently used for those applications.…”

Section: Introductionmentioning

confidence: 99%

An Experimental Study of Fabrication of Cellulose Nano-Fiber Composited Ni Film by Electroplating

et al. 2022

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The purpose of this study is to investigate the conditions of fabrication of cellulose nano-fiber (CNF) composited Ni plating film by electroplating method and clarifying the codeposition mechanism. The electroplating was carried out on SUS304H using Watts bath with CNF suspended. The obtained films were evaluated by surface and cross-sectional observation including elemental mapping analysis, X-ray fluorescence analysis and Vickers hardness testing. The obtained film had a double layer structure parallel to the plating surface, and the layer on the substrate side contained a large amount of CNF. This layer is considered to be formed by physical trapping of CNF in the pitting corrosion and the delaminated area inside the substrate caused by the effect of chloride ion and hydrogen gas. It was also suggested that the electrostatic repulsion between CNF and the substrate was one of the factors that resulted in little CNF codeposition within the surface side layer. In addition, the Vickers hardness of the surface was improved by approximately 30% compared to electroplated Ni film without CNF.

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Recent Development of Joining and Conductive Materials for Electronic Components

Cited by 11 publications

References 130 publications

Thermodynamic Modeling of the Au-Ge-X (X = In, Sb, Si, Zn) Ternary Systems

Thermodynamic Modeling of the Au-Ge-X (X = In, Sb, Si, Zn) Ternary Systems

Effect of Plating Potential on Three-Dimensional Structural Plating Films and their Adhesion to Epoxy Resin

An Experimental Study of Fabrication of Cellulose Nano-Fiber Composited Ni Film by Electroplating

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