Effect of Plating Potential on Three-Dimensional Structural Plating Films and their Adhesion to Epoxy Resin

Abstract

This study investigated the electrochemical behavior of Ni–Cu alloy plating baths during plating and dealloying reactions. Furthermore, the potential and plating time effects on the shape of three-dimensional structural Ni–Cu alloy plating film and its adhesion to epoxy resin were investigated. Nodules were observed on the surface of the plating film generated at potentials from-0.5 V to-1.0 V. When the plating films formed at potentials of-1.0 V to-1.5 V were dealloyed, the formation of pores was observed. The shear test results showed that the average shear strength of the specimen joined with epoxy resin between two Cu plates with Ni–Cu alloy plating film formed at a potential of-1.0 V was the highest under all conditions.