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Metal gate work function enhancement using thin AlNx interfacial layers has been evaluated. It was found that band edge effective work functions (∼5.10eV) can be achieved on hafnium-based high dielectric constant (high-k) materials using the AlNx interfacial layer and TiSiN electrodes. It was also found that the effective work function enhancement by the AlNx interfacial layer increased when the concentration of SiO2 in the gate dielectric was increased. Thus, the enhancement was minimal for HfO2 and maximum for SiO2. A model is proposed to explain these results and a bonding analysis is presented to support the proposed model.

Physical and electrical properties of metal gate electrodes on HfO 2 gate dielectrics

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It is shown that the work function of Ta1−xAlxNy depends on the electrode and gate dielectric compositions. Specifically, the work function of Ta1−xAlxNy increased with SiO2 content in the gate dielectric, reaching as high as 5.0eV on SiO2; the work function was nearly 400mV smaller on HfO2. In addition, the work function decreased with increasing nitrogen content in the Ta1−xAlxNy metal gate. Increasing Al concentration increased the work function up to about 15% Al, but the work function decreased for higher Al concentrations. Chemical analysis shows that Al–O bonding at the interface correlates with the observed work function values.

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We demonstrate that the metallic capping layer has a strong impact on the effective work function (EWF) of the metal gate. Specifically, the EWF of atomic-layer-deposited (ALD)-TaN could be increased from 4.5to4.8eV with chemical-vapor-deposited-TiN capping, which is sufficient amount of work function modification for silicon on insulator based devices. A strong interdiffusion of Ti atoms into the ALD-TaN film is observed and correlated well with the changes in the EWF change. Ti capping experiments confirm that the Ti interdiffusion can actually modify the EWF of Ti/ALD-TaN stack.

No abstract