Articles you may be interested inHigh-throughput electron-beam lithography with a raster-scanned, variably shaped beam

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An e-beam test system has been developed to detect opens and shorts in three-dimensional networks of conductors embedded in a dielectric matrix. The specimens, which measure up to 100×100 mm, are tested electrically without making physical contact and without mechanical stepping. The system comprise two flood beams and a focused probe beam deflected over the full specimen area at a resolution of better than 3000 lines at 1–2 kV beam energy. One flood gun is located at the rear, the other at the front of the specimen. The change in secondary emission imposed by impinging electrons charging or discharging the surface is detected as voltage contrast which allows one to discriminate between uninterrupted and interrupted as well as shorted pairs of conductors. The physical concept, the contrast mechanism, and the electron optics of the system will be presented together with experimental results.

IBM's high-throughput e-beam stepper approach PRojection Exposure with Variable Axis Immersion Lenses (PREVAIL) is reviewed. The PREVAIL concept combines technology building blocks of our probe-forming EL-3 and EL-4 systems with the exposure efficiency of pattern projection. The technology represents an extension of the shaped-beam approach toward massively parallel pixel projection. As demonstrated, the use of variable-axis lenses can provide large field coverage through reduction of off-axis aberrations which limit the performance of conventional projection systems. Subfield pattern sections containing 107 or more pixels can be electronically selected (mask plane), projected and positioned (wafer plane) at high speed. To generate the entire chip pattern subfields must be stitched together sequentially in a combination of electronic and mechanical positioning of mask and wafer. The PREVAIL technology promises throughput levels competitive with those of optical steppers at superior resolution. The PREVAIL project is being pursued to demonstrate the viability of the technology and to develop an e-beam alternative to “suboptical” lithography.

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Scaled measurements of global space-charge induced image blur in electron beam projection systemElectron and ion optical design software for integrated circuit manufacturing equipment