Variable spot shaping for electron-beam lithography

Pfeiffer, H. C.

doi:10.1116/1.569621

Cited by 101 publications

(23 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…An upper bound on shot saving can be obtained by a linear relaxation of a 0-1 knapsack problem with capacity R(W + E − S − w min ) such that the profit and weight of each item correspond to the shot saving and effective width of each character in our problem. 4 As the authors of [8] and [9] have given us the updated versions of their codes, their results here are slightly better than those reported in [9]. harder benchmarks while the runtime of [9] increased quickly with harder benchmarks.…”

Section: Resultsmentioning

confidence: 67%

“…Columns 5, 7, 10, and 13 report the number of characters that can be packed in the stencil. 4 The runtimes of [8], [9], and CASCO are listed in columns 8, 11, and 14, respectively. It can be seen that CASCO achieves near optimal shot saving on all four benchmarks.…”

Section: Resultsmentioning

confidence: 99%

“…The throughput of an e-beam writing system using the traditional variable-shaped beam (VSB) method [4] is very low. In the VSB method, the patterns to be printed are divided into constituent rectangles and triangles as in Fig.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

E-Beam Lithography Character and Stencil Co-Optimization

Mak

Chu

2014

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

View full text Add to dashboard Cite

Abstract-Electron-beam maskless lithography is being actively explored by the semiconductor industry for chip production in the sub-22nm regime. Character projection allows in one ebeam shot the printing of complex pattern rather than merely a single rectangle or triangle as in variable-shaped beam projection. However, those circuit patterns that do not match any character on the stencil still have to be written by variable-shaped beam projection. We investigate a new problem of character and stencil co-optimization with blank space sharing between characters so as to minimize the total number of shots required for printing a circuit. We exploit the fact that the blank spaces on the sides of a character can be adjusted by moving the pattern to be printed within its projection region to facilitate blank space sharing so as to pack more characters into the stencil. Even though the co-optimization problem is shown to be NP-complete, we are able to design an elegant approximation algorithm, CASCO. Experiments confirm that the solutions by CASCO are nearly optimal. Compared to the published state of the art, CASCO reduces the shot count by 1.59× while it is also orders of magnitude faster.

show abstract

Section: Resultsmentioning

confidence: 67%

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

E-Beam Lithography Character and Stencil Co-Optimization

Mak

Chu

2014

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

View full text Add to dashboard Cite

show abstract

“…The EBDW can draw patterns onto silicon wafers masklessly or quasi-masklessly (Inanami, 2000;Pfeiffer, 1979). The throughput of the conventional EBDW equipment which adopts the variable shaped beam (VSB) method (Pfeiffer, 1978) is, however, extremely low. In the VSB method, exposed patterns are divided into a large number of small rectangular and triangular shapes to draw them as shown in the left of Fig.…”

Section: Introductionmentioning

confidence: 99%

Character Projection Lithography for Application-Specific Integrated Circuits

Sugihara¹

2011

Recent Advances in Nanofabrication Techniques and Applications

View full text Add to dashboard Cite

“…The throughput of the conventional EBDW equipment which adopts the variable shaped beam (VSB) method [3] is, however, extremely low. In the VSB method, exposed patterns are divided into a large number of small rectangular and triangular shapes to draw them as shown in the left of Figure 1.…”

Section: Introductionmentioning

confidence: 99%

A Character Size Optimization Technique for Throughput Enhancement of Character Projection Lithography

Sugihara

Takata

Nakamura

et al.

2006 IEEE International Symposium on Circuits and Systems

View full text Add to dashboard Cite

Abstract-We propose a character size optimization technique to enhance the throughput of maskless lithography as well as photomask manufacture. The number of electron beam shots to draw the patterns of circuits is a dominant factor in the manufacture time and the cost for devices. Our technique is capable of drastically reducing them by optimizing the size of characters, which are the patterns to project and are placed on CP masks. Experimental results show that our technique reduced 72.0% of EB shots in the best case, comparing with the ad hoc character sizing.

show abstract

Variable spot shaping for electron-beam lithography

Abstract: Articles you may be interested inHigh-throughput electron-beam lithography with a raster-scanned, variably shaped beam

Cited by 101 publications

References 0 publications

E-Beam Lithography Character and Stencil Co-Optimization

E-Beam Lithography Character and Stencil Co-Optimization

Character Projection Lithography for Application-Specific Integrated Circuits

A Character Size Optimization Technique for Throughput Enhancement of Character Projection Lithography

Contact Info

Product

Resources

About