Node-agnostic Cu TSVs integrated with high-K/metal gate and embedded DRAM were used in functional 3D modules.Thermal cycling and stress results show no degradation of TSV or BEOL structures, and device and functional data indicate that there is no significant impact from TSV processing and/or proximity.
Short wavelength (SWIR; 1 to 3 jim), middle wavelength (MWIR; 3 to 5 tim), mid-long wavelength (MLWIR; 6 to 8 tim), long wavelength (LWIR; 8 to 14 tim), and very long wavelength (VLWIR; > 14 tim) Focal Plane Arrays (FPAs) are required for remote sensing applications. Advances in the Molecular Beam Epitaxy (MBE) growth of Mercury Cadmium Telluride (HgCdTe) and detector architectures utilized, have resulted in high performance detectors being fabricated in the 1 im to 16 im spectral range. Custom Read Out Integrated Circuits (ROICs) are designed and fabricated to interface the HgCdTe detector arrays. The hybrid focal plane array is made up of the HgCdTe detector array and the CMOS-based ROTC.
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