This paper reports a thin wafer handling technology that is compatible to CMOS processing conditions to enable 3D integration and assembly with high throughput at low cost. Using pulsed ultraviolet (UV) radiation from excimer lasers, device wafers as thin as 50µm can be released from the temporary mechanical handler wafer in less than 1min. Bonding, adhesive, debonding and post debond clean processes were demonstrated. CMOS circuit test vehicles were shown to be compatible with this temporary bonding and debonding processes.
The ability to electrodeposit magnetic (CoNiFeCu) and semiconductor (Bi2Te3) nanotubes was demonstrated from two different electrochemical systems. Electrodeposited multilayered CoNiFeCu/Cu nanotubes were fabricated by pulsing the applied potential. The electrolyte temperature affected the tube formation and the nanotubes giant magnetoresistance (GMR) saturation field. Both p/n-type Bi2Te3 alloy nanotubes were deposited under constant potential from different electrolyte concentrations and component ratios. We report the Seebeck coefficient measurement method for Bi2Te3 alloy nanotubes obtained by electrodeposition.
This work is a part of an on-going research effort to fabricate a device consisting of an array of micro thermoelectric
coolers (μTECs) for highly localized control of temperature in biological systems. A preliminary lumped 1-D parameter
model was developed and numerical simulations were carried out to identify the critical and optimal design parameters
for a μTEC operating under steady state conditions. The lumped parameter analysis revealed the presence of a
new limitation on the maximum possible current through the system, which we denoted as the secondary breakdown current
(as opposed to the primary breakdown current associated with Joules heating). To further understand the effect of
contact resistances (thermal and electrical), radiative effects, and lateral effects (interactions between μTECs) in our device,
we developed a 3-D finite element model (FEM) using ANSYS®. The FEM analysis identified the optimal distance
between μTECs to generate discrete and distinct temperatures within the cells located in the extracellular matrix and thus,
generating the optimal design specifications for our device.
This work is a part of an on-going research effort to develop an array of micro thermoelectric coolers (TECs) for highly localized control of temperature at the cellular level. Prefabrication experimentation and modeling were carried out to understand the behavior of the proposed device. Mathematical models were used to identify important device parameters and optimal device dimensions. Preliminary experiments have shown that it is feasible to produce the TECs through electrodeposition of bismuth and telluride on modules produced using a modified multistep LIGA (Lithographie, Galvanoformung and Abformung) technique. The development and characterization of the proposed TECs would enable the bioengineer highly localized control of temperature in a native or artificial tissue system. Thus enabling further usage of low temperatures in biological systems for both destructive (cryosurgical) and beneficial (cryopreservation) procedures.
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