Abstract. This paper reports a novel approach for the fabrication of infrared (IR) emitters for non-dispersive infrared gas sensing. The proposed concept enables the integration of superior resistive heater materials with microelectromechanical systems (MEMS) structures. In this study, non-bondable filaments made of nickel chromium are attached to mechanical attachment structures using a fully automated state-of-the-art wire bonder. The formation of the electrical contacts between the integrated filaments and the electrical contact pattern on the substrate is performed using conventional gold stud bumping technology. The placement accuracy of the integrated filaments is evaluated using white-light interferometry, while the contact formation using stud bumping to embed the filaments is investigated using focus ion beam milled crosssections. A proof-of-concept IR emitter has been successfully operated and heated up to 960• C in continuous mode for 3 hours.Wire bonding, integration platform, stud bumping, MEMS, MEMS-based infrared emitter, NDIR, gas sensing, non-bondable materials, nickel-chromium wire, NiCr filament, Nikrothal wire, resistive heating, joule heating: