Fabrication of an infrared emitter using a generic integration platform based on wire bonding

Abstract

Abstract. This paper reports a novel approach for the fabrication of infrared (IR) emitters for non-dispersive infrared gas sensing. The proposed concept enables the integration of superior resistive heater materials with microelectromechanical systems (MEMS) structures. In this study, non-bondable filaments made of nickel chromium are attached to mechanical attachment structures using a fully automated state-of-the-art wire bonder. The formation of the electrical contacts between the integrated filaments and the electrical contact pattern on the substrate is performed using conventional gold stud bumping technology. The placement accuracy of the integrated filaments is evaluated using white-light interferometry, while the contact formation using stud bumping to embed the filaments is investigated using focus ion beam milled crosssections. A proof-of-concept IR emitter has been successfully operated and heated up to 960• C in continuous mode for 3 hours.Wire bonding, integration platform, stud bumping, MEMS, MEMS-based infrared emitter, NDIR, gas sensing, non-bondable materials, nickel-chromium wire, NiCr filament, Nikrothal wire, resistive heating, joule heating:

Transfer printing of nanomaterials and microstructures using a wire bonder

“…Wire bonding is an extremely fast, cost-efficient and well-established packaging process used in the semiconductor industry to form electrical connections between the semiconductor dies and the die package. Wire bonding has recently also been investigated for use in various unconventional applications [26][27][28][29]. In this paper we demonstrate the feasibility of using a commercial high-speed fully automated wire bonding tool for transfer printing of SWCNTs onto PDMS, parylene, Au/parylene and silicon substrates, with potential applications in flexible electronics and field emission applications.…”

A single wire large-area filament emitter for spectroscopic ethanol gas sensing fabricated using a wire bonding tool

“…Wire bonding is a very mature, effective and reliable electrical interconnection technology, which has been proposed for multiple innovative MEMS packaging and heterogeneous integration approaches [9,10]. Recently we have reported of an integration platform for filamentbased emitters, that necessitate multiple filament integration process steps, resulting in an elaborate fabrication sequence [11]. Here we report on a rapid and more cost-effective fabrication for IR emitters by integrating a single wire filament utilizing an automated wire bonder.…”