A single wire large-area filament emitter for spectroscopic ethanol gas sensing fabricated using a wire bonding tool

Schröder, Stephan; Rödjegård, Henrik; Stemme, Göran; Niklaus, Frank

doi:10.1109/transducers.2017.7994052

Cited by 4 publications

(2 citation statements)

References 9 publications

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“…This means that novel and complex materials need to be involved and engineered for improved performance. One such option was recently developed for ethanol (9.5

m) and CO 2 (4.3

m) detection using a single wire Kanthal (FeCrAl) alloy filament [ 84 , 85 ].…”

Section: State-of-the-art In Gas Sensing Technologiesmentioning

confidence: 99%

Application of Two-Dimensional Materials towards CMOS-Integrated Gas Sensors

Filipovic

Selberherr

2022

Nanomaterials

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During the last few decades, the microelectronics industry has actively been investigating the potential for the functional integration of semiconductor-based devices beyond digital logic and memory, which includes RF and analog circuits, biochips, and sensors, on the same chip. In the case of gas sensor integration, it is necessary that future devices can be manufactured using a fabrication technology which is also compatible with the processes applied to digital logic transistors. This will likely involve adopting the mature complementary metal oxide semiconductor (CMOS) fabrication technique or a technique which is compatible with CMOS due to the inherent low costs, scalability, and potential for mass production that this technology provides. While chemiresistive semiconductor metal oxide (SMO) gas sensors have been the principal semiconductor-based gas sensor technology investigated in the past, resulting in their eventual commercialization, they need high-temperature operation to provide sufficient energies for the surface chemical reactions essential for the molecular detection of gases in the ambient. Therefore, the integration of a microheater in a MEMS structure is a requirement, which can be quite complex. This is, therefore, undesirable and room temperature, or at least near-room temperature, solutions are readily being investigated and sought after. Room-temperature SMO operation has been achieved using UV illumination, but this further complicates CMOS integration. Recent studies suggest that two-dimensional (2D) materials may offer a solution to this problem since they have a high likelihood for integration with sophisticated CMOS fabrication while also providing a high sensitivity towards a plethora of gases of interest, even at room temperature. This review discusses many types of promising 2D materials which show high potential for integration as channel materials for digital logic field effect transistors (FETs) as well as chemiresistive and FET-based sensing films, due to the presence of a sufficiently wide band gap. This excludes graphene from this review, while recent achievements in gas sensing with graphene oxide, reduced graphene oxide, transition metal dichalcogenides (TMDs), phosphorene, and MXenes are examined.

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“…This means that novel and complex materials need to be involved and engineered for improved performance. One such option was recently developed for ethanol (9.5

m) and CO 2 (4.3

m) detection using a single wire Kanthal (FeCrAl) alloy filament [ 84 , 85 ].…”

Section: State-of-the-art In Gas Sensing Technologiesmentioning

confidence: 99%

Application of Two-Dimensional Materials towards CMOS-Integrated Gas Sensors

Filipovic

Selberherr

2022

Nanomaterials

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“…Wire bonding is an extremely fast, cost-efficient and well-established packaging process used in the semiconductor industry to form electrical connections between the semiconductor dies and the die package. Wire bonding has recently also been investigated for use in various unconventional applications [26][27][28][29]. In this paper we demonstrate the feasibility of using a commercial high-speed fully automated wire bonding tool for transfer printing of SWCNTs onto PDMS, parylene, Au/parylene and silicon substrates, with potential applications in flexible electronics and field emission applications.…”

Section: Introductionmentioning

confidence: 97%

Transfer printing of nanomaterials and microstructures using a wire bonder

Wang

Schröder

Enrico

et al. 2019

J. Micromech. Microeng.

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Scalable and cost-efficient transfer of nanomaterials and microstructures from their original fabrication substrate to a new host substrate is a key challenge for realizing heterogeneously integrated functional systems, such as sensors, photonics, and electronics. Here we demonstrate a high-throughput and versatile integration method utilizing conventional wire bonding tools to transfer-print carbon nanotubes (CNTs) and silicon microstructures. Standard ball stitch wire bonding cycles were used as scalable and high-speed pick-and-place operations to realize the material transfer. Our experimental results demonstrated successful transfer printing of single-walled CNTs (100 m-diameter patches) from their growth substrate to polydimethylsiloxane, parylene, or Au/parylene electrode substrates, and realization of field emission cathodes made of CNTs on a silicon substrate. Field emission measurements manifested excellent emission performance of the CNT electrodes. Further, we demonstrated the utility of a high-speed wire bonder for transfer printing of silicon microstructures (60 m 60 m 20 m) from the original silicon on insulator substrate to a new host substrate. The achieved placement accuracy of the CNT patches and silicon microstructures on the target substrates were within 4 m. These results show the potential of using established and extremely cost-efficient semiconductor wire bonding infrastructure for transfer printing of nanomaterials and microstructures to realize integrated microsystems and flexible electronics.

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A large-area single-filament infrared emitter and its application in a spectroscopic ethanol gas sensing system

et al. 2021

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Nondispersive infrared (NDIR) spectroscopy is an important technology for highly accurate and maintenance-free sensing of gases, such as ethanol and carbon dioxide. However, NDIR spectroscopy systems are currently too expensive, e.g., for consumer and automotive applications, as the infrared (IR) emitter is a critical but costly component of these systems. Here, we report on a low-cost large-area IR emitter featuring a broadband emission spectrum suitable for small NDIR gas spectroscopy systems. The infrared emitter utilizes Joule heating of a Kanthal (FeCrAl) filament that is integrated in the base substrate using an automated high-speed wire bonding process, enabling simple and rapid formation of a long meander-shaped filament. We describe the critical infrared emitter characteristics, including the effective infrared emission spectrum, thermal frequency response, and power consumption. Finally, we integrate the emitter into a handheld breath alcohol analyzer and show its operation in both laboratory and real-world settings, thereby demonstrating the potential of the emitter for future low-cost optical gas sensor applications.

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A single wire large-area filament emitter for spectroscopic ethanol gas sensing fabricated using a wire bonding tool

Cited by 4 publications

References 9 publications

Application of Two-Dimensional Materials towards CMOS-Integrated Gas Sensors

Application of Two-Dimensional Materials towards CMOS-Integrated Gas Sensors

Transfer printing of nanomaterials and microstructures using a wire bonder

A large-area single-filament infrared emitter and its application in a spectroscopic ethanol gas sensing system

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