2007
DOI: 10.1016/j.mee.2007.04.105
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Borderless silicon nitride defect behaviour and their influences on initial data loss in single polysilicon flash memories

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Cited by 4 publications
(6 citation statements)
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“…Second, there is a surprising minority carrier response at high-frequency measurement that is attributed to a permanent inversion layer. 5 Finally, steady-state charge behavior cannot be characterized because of the opening of the hysteresis according to the sweep direction.…”
Section: Analysis Of Non-steady-state C-v Characteristicsmentioning
confidence: 99%
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“…Second, there is a surprising minority carrier response at high-frequency measurement that is attributed to a permanent inversion layer. 5 Finally, steady-state charge behavior cannot be characterized because of the opening of the hysteresis according to the sweep direction.…”
Section: Analysis Of Non-steady-state C-v Characteristicsmentioning
confidence: 99%
“…2͒ is positive and equal to 4.5 ϫ 10 −7 , 4.1 ϫ 10 −7 , and 3.9 ϫ 10 −7 C/cm 2 for recipes A, B, and C, respectively. These charges, also extended around the area defined by the gate ͑a-Si x N y :H partially etched during gate etch͒, attract some minority carriers and act as a source and drain reservoir to create the permanent inversion layer, 5 which resulted in the minority carrier response at high-frequency excitation. Charges can be balanced between the two states; for the up-sweep, the charge is largely positive, whereas for the down-sweep, this quantity decreases until reaching a negative sign ͑recipe A: Q up = 1.9 ϫ 10 −6 C/cm 2 , Q down = −1.5 ϫ 10 −8 C/cm 2 ; recipe B: Q up = 1.1 ϫ 10 −6 C/cm 2 , Q down = −4.1 ϫ 10 −8 C/cm 2 ; recipe C: Q up = 1.6 ϫ 10 −6 C/cm 2 , Q down = −3.3 ϫ 10 −7 C/cm 2 ͒.…”
Section: Analysis Of Non-steady-state C-v Characteristicsmentioning
confidence: 99%
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“…1 It must be guaranteed over ten years at quite high temperature ͑85°C͒. 5 Thus, the most probable hypothesis is that charges contained in the a-Si x N y : H induced capacitive effects on the FG one. Indeed, the floating gate ͑FG͒ being no longer encapsulated by the control gate, its sensitivity to various process steps increases, increasing charge loss mechanisms.…”
Section: Introductionmentioning
confidence: 99%
“…However, when considering low cost ͑no added process step͒ single polysilicon ͑SP͒ flash cells, this requirement become even more critical. 3,5 In this context, the aim of this study is to understand how physico-electrical a-Si x N y : H properties impact the SP NVM DR by a design of experiment ͑DOE͒ on PECVD process conditions. Recently, two charge loss phases have been distinguished for such a cell during accelerated 250°C DR bake.…”
Section: Introductionmentioning
confidence: 99%