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How would you……describe the overall signifi cance of this paper? Potential lead-free solder candidates for high-temperature applications that were determined by using computational thermodynamics were assessed from the corrosion perspective. This work reveals that, among the two primary candidate alloys for high-temperature solders, Au-Sn-based candidate alloys close to the eutectic composition are more corrosion resistant than the Au-Gebased ones.…describe this work to a materials science and engineering professional with no experience in your technical specialty? The solder candidates that could adhere to the solidifi cation criterion required for replacing the high-leadcontaining solders were investigated from the corrosion perspective. An overview of corrosion-related problems that have to be thoroughly investigated before substituting the currently used one has been reported. …describe this work to a layperson?A drive for miniaturization, multiplicity of materials, and globalization has resulted in corrosion being a signifi cant issue in the complex electronic packaging systems that are being developed. The possible corrosion scenario for the promising lead-free solder candidates in such packaging for high-temperature applications has been investigated in this work.The step-soldering approach is being employed in the multi-chip module technology. High-lead-containing alloys are among the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work, a corrosion investigation was carried out on potential ternary lead-free candidate alloys based on these binary alloys for high-temperature applications. These promising ternary candidate alloys were determined by the CALPHAD approach based on the solidifi cation criterion and the nature of the phases predicted in the bulk solder. This work reveals that the Au-Sn-based candidate alloys close to the eutectic composition (20 wt.% Sn) are more corrosion resistant than the Au-Ge-based ones.

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