Development of Au–Ge based candidate alloys as an alternative to high-lead content solders

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

doi:10.1016/j.jallcom.2009.10.108

Cited by 112 publications

(40 citation statements)

References 12 publications

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“…Reliable thermodynamic information on the relative stabilities of TM-germanides is essential to control the interfacial microstructure evolution and thus to design optimal processing. On the other hand, Au-based alloys containing Ge are of interest for novel high temperature lead-free solder alloys [6][7][8][9]. For example, the Au-Ge binary system is characterised by a deep eutectic reaction with its temperature of around 360 • C, making it interesting for high temperature Au-based solders.…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic assessment of the Cu–Ge binary system

Wang

Jin

Leinenbach

et al. 2010

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 99%

Thermodynamic assessment of the Cu–Ge binary system

Wang

Jin

Leinenbach

et al. 2010

Journal of Alloys and Compounds

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“…Currently, there is a shift from lead-based alloys to lead-free alloys because of the environmental impacts of lead, globally [144], [65], [148], [149]. More and more lead-free solders are being developed to substitute lead based solders [141], [142], [150]- [152]. The tin-silver-copper (SnAgCu or SAC) solder alloys have been reported to be the best alternative for eutectic SnPb solder in the PV industry [144], [153].…”

Section: Lead Free Soldermentioning

confidence: 99%

A review of photovoltaic module technologies for increased performance in tropical climate

Ogbomo

Amalu

Ekere

et al. 2017

Renewable and Sustainable Energy Reviews

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The global adoption and use of photovoltaic modules (PVMs) as the main source of energy is the key to realising the UN Millennium Development Goals on Green Energy. The technology -projected to contribute about 20% of world energy supply by 2050, over 60% by 2100 and leading to 50% reduction in global CO 2 emissions -is threatened by its poor performance in tropical climate. Such performance discourages its regional acceptance. The magnitude of crucial module performance influencing factors (cell temperature, wind speed and relative humidity) reach critical values of 90°C, 0.2 m/s and 85%, respectively in tropical climates which negatively impact module performance indices which include power output (PO), power conversion efficiency (PCE) and energy payback time (EPBT). This investigation reviews PVM technologies which include cell, contact and interconnection technologies. It identifies critical technology route(s) with potential to increase operational reliability of PVMs in the tropics when adopted. The cell performance is measured by PO, PCE and EPBT while contacts and interconnections performance is measured by the degree of recombination, shading losses and also the rate of thermo-mechanical degradation. It is found that the mono-crystalline cell has the best PCE of 25% while the Cadmium Telluride (CdTe) cell has the lowest EPBT of 8-months. Results show that the poly-crystalline cell has the largest market share amounting to 54%. The CdTe cell exhibits 0% drop in PCE at high-temperatures and low irradiance operations -demonstrating least affected PO by the conditions. Further results establish that back contacts and back-to-back interconnection technologies produce the least recombination losses and demonstrate absence of shading in addition to possessing longest interconnection fatigue life. Based on these findings, the authors propose a PVM comprising CdTe cell, back contacts and backto-back interconnection technologies as the technology with latent capacity to produce improved performance in tropical climates. Keywordsphotovoltaic modules; solar cell technology; contact technology; interconnection technology; energy payback time; power conversion efficiency; fatigue life. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 2 *Manuscript Click here to view linked References IntroductionThe annual electrical power consumption of the entire planet can be generated by the sun in just one hour [1]. Thus, solar energy is abundant in addition to being clean, sustainable and renewable [2], [3]. Surprisingly, some parts of the world are still struggling to meet their energy needs. It may suffice to say that the regions experiencing energy issues may be having energy conversion problems rather than energy supply problems [2], [4]. It is projected that if 100% exploitation of the energy potentials of the sun ca...

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“…Other high-temperature solder alloys, such as AuSn, Zn-Al, Au-Ge, Bi-Ag could be adopted, but each of these has its own drawbacks and limitations, such as high cost, inherent brittleness, and susceptibility to oxidation and corrosion. [7][8][9][10] In addition, the high process temperatures during soldering or brazing tend to induce large residual stresses generated by the coefficient of thermal expansion (CTE) mismatch after the solidification of the interconnections, leading to the deterioration of the mechanical strength and thermomechanical performance or even early failure. Furthermore, electronic assembly products may contain temperature-sensitive components that must not be overheated.…”

Section: Introductionmentioning

confidence: 99%

Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging

Wang

Guo

et al. 2017

Adv Eng Mater

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In this paper, the authors propose a highly conductive die attach material based on Ag@Sn powder for power devices operating at high temperatures or in other harsh environments. The preform can be reflowed at 250 C (18 C above the T m of Sn, 232 C), but the resulting bondline can sustain high temperatures up to 400 C with a high shear strength due to the high re-melting temperature of the formed Ag 3 Sn (T m ¼ 480 C) after the complete consumption of the outer Sn layers. In addition, the formed bondline exhibits excellent electrical and thermal conductivities due to the embedded Ag particles in the interconnections. The interconnections also exhibit excellent reliability under thermal shock cycling from À55 to 200 C because of the increased bondline thickness and inherent ductility of the Ag particles embedded in the Ag 3 Sn.

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Development of Au–Ge based candidate alloys as an alternative to high-lead content solders

Cited by 112 publications

References 12 publications

Thermodynamic assessment of the Cu–Ge binary system

Thermodynamic assessment of the Cu–Ge binary system

A review of photovoltaic module technologies for increased performance in tropical climate

Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging

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