Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system

Chidambaram, Vivek; Hattel, Jesper Henri; Hald, John

doi:10.1016/j.matdes.2010.05.035

Cited by 87 publications

(28 citation statements)

References 11 publications

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“…Extensive research in the area of developing high temperature Pb free solder is in progress, there is still no solder alloy which can completely replace Pb based high temperature solders [4]. Several prospective candidates, such as Au based alloys, Bi based alloys and Ag based alloys have been reported [5][6][7][8][9][10][11][12][13][14]. Currently, Zn based alloys have been emerged as potential candidate in substituting health hazardous Pb containing solders.…”

Section: Introductionmentioning

confidence: 99%

Study of off-eutectic Zn–xMg high temperature solder alloys

Galib

Hasan

Sharif

2016

J Mater Sci: Mater Electron

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Researchers have been working for some times to develop a Pb-free substitute for high-Pb containing solders in electronics. In this study the effect of Mg content on microstructure, melting behavior, thermal, electrical and mechanical properties of a new high-temperature Pb-free solder based on binary Zn-Mg alloy were investigated. The nominal compositions of Zn-xMg (x = 0.5-6.0) alloys were synthesized by conventional melting and casting route. The microstructures of the solders changed significantly on adding Mg content. Higher Mg containing alloys were found rich in intermetallic phases. The formation of the Mg 2 Zn 11 and metastable MgZn 2 intermetallic phases were identified and were also quantified by X-ray diffraction analysis. The presence of higher amount of intermetallic compounds in hypereutectic Zn-Mg systems deteriorated the tensile properties of the binary alloy. The results of electrical resistivity test indicated that the Mg could elevate the resistivity of newly developed Zn-Mg alloys. The melting behavior of the solder alloys studied by differential thermal analysis (DTA) analysis revealed that the melting temperature range of the solder alloys narrowed with Mg addition. Thermal mechanical analysis (TMA) analysis revealed that the co-efficient of thermal expansion (CTE) decreased on increasing Mg content.

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Section: Introductionmentioning

confidence: 99%

Study of off-eutectic Zn–xMg high temperature solder alloys

Galib

Hasan

Sharif

2016

J Mater Sci: Mater Electron

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“…Other high-temperature solder alloys, such as AuSn, Zn-Al, Au-Ge, Bi-Ag could be adopted, but each of these has its own drawbacks and limitations, such as high cost, inherent brittleness, and susceptibility to oxidation and corrosion. [7][8][9][10] In addition, the high process temperatures during soldering or brazing tend to induce large residual stresses generated by the coefficient of thermal expansion (CTE) mismatch after the solidification of the interconnections, leading to the deterioration of the mechanical strength and thermomechanical performance or even early failure. Furthermore, electronic assembly products may contain temperature-sensitive components that must not be overheated.…”

Section: Introductionmentioning

confidence: 99%

Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging

Wang

Guo

et al. 2017

Adv Eng Mater

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In this paper, the authors propose a highly conductive die attach material based on Ag@Sn powder for power devices operating at high temperatures or in other harsh environments. The preform can be reflowed at 250 C (18 C above the T m of Sn, 232 C), but the resulting bondline can sustain high temperatures up to 400 C with a high shear strength due to the high re-melting temperature of the formed Ag 3 Sn (T m ¼ 480 C) after the complete consumption of the outer Sn layers. In addition, the formed bondline exhibits excellent electrical and thermal conductivities due to the embedded Ag particles in the interconnections. The interconnections also exhibit excellent reliability under thermal shock cycling from À55 to 200 C because of the increased bondline thickness and inherent ductility of the Ag particles embedded in the Ag 3 Sn.

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“…Many different sectors can benefit from such a die attach material such as power electronics, deep-well oil and gas exploration, and implementation of wide-bandgap semiconductors into industry, where even 400 °C operating temperature is a target for near future applications [2]. Two important categories of die attach materials intended for high power/temperature applications are high temperature solders, mainly high gold content solders [3,4], and Transient Liquid Phase Diffusion Bonding (TLPDB) materials [5]. However, the impetus for research on developing more reliable die attach materials arises from problems with these current materials, which are residual stresses in case of solders [6], and reduction of mechanical strength at elevated temperature in case of TLPDB materials, even if the temperature is well below the melting point of the system intermetallics [7].…”

Section: Introductionmentioning

confidence: 99%

Ultra-Stable Sintered Silver Die Attach for Demanding High-Power/Temperature Applications

Paknejad

Khtatba

Mansourian

et al. 2017

IEEE Trans. Device Mater. Relib.

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Abstract:A novel and simple processing step has been demonstrated to produce thermally stable sintered silver nanoparticles structures. Sintered silver has been investigated as a die attach to resolve the long-standing demand for a reliable material to enable high power/temperature electronics operating above 300 °C. However, it is now a well-known fact that such materials undergo massive microstructural evolution at 250 °C and above, creating doubts about their longterm reliability. Here an additional processing step utilizing oxidizing treatment is demonstrated to immobilize the silver atoms through formation of Ag2O. This technique stabilizes sintered silver up to 400 °C, taking advantage of the open pore network to facilitate treatment deep in the material interior.

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Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system

Cited by 87 publications

References 11 publications

Study of off-eutectic Zn–xMg high temperature solder alloys

Study of off-eutectic Zn–xMg high temperature solder alloys

Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging

Ultra-Stable Sintered Silver Die Attach for Demanding High-Power/Temperature Applications

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