High-temperature lead-free solder alternatives

Chidambaram, Vivek; Hattel, Jesper Henri; Hald, John

doi:10.1016/j.mee.2010.12.072

Cited by 166 publications

(45 citation statements)

References 29 publications

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“…Especially, bismuth is attracting attention as a lead-free soldering material with a high melting point [1][2][3][4] . In fact, however, mechanical characteristics and properties necessary for the reliability analysis of micro solder joints have seldom been investigated and they are still unknown.…”

Section: Introductionmentioning

confidence: 99%

Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals in Principal Axes

et al. 2016

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Section: Introductionmentioning

confidence: 99%

Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals in Principal Axes

et al. 2016

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“…It also plays an important role in the joining of metal components in the transportation, aerospace and energy industries [1][2][3]. Driven by miniaturization and increased requirements for advanced electronic devices, it is crucial to develop a solder alloy that can remain stable under extreme environments and perform well under high temperature operating systems [4].…”

Section: Introductionmentioning

confidence: 99%

“…In addition, attempts have also been made in improving the solderability of SAC305 solder alloy in high temperature electronic applications by altering the joining methods through the utilization of an interlayer material in the soldering process, such as during the transient liquid phase (TLP) bonding process. TLP bonding is an established joining technique for die attach bonding in the application of high temperature electronic systems [2]. Generally, a thin layer of low melting point metal is utilized as the interlayer material for an effective bonding during the TLP process.…”

Section: Introductionmentioning

confidence: 99%

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

Jamadon

Tan

Yusof

et al. 2016

Metals

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Abstract:The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi-pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and 300 s at three temperature levels of 267, 287, and 307 • C. The joint strength was evaluated by tensile testing. The highest strength for solder joints with addition of P25 and P15 porous Cu was 51 MPa (at 180 s and 307 • C) and 54 MPa (at 300 s and 307 • C ), respectively. The fractography of the solder joint was analyzed by optical microscope (OM) and scanning electron microscopy (SEM). The results showed that the propagation of fracture during tensile tests for solder with a porous Cu interlayer occurred in three regions: (i) SAC305/Cu interface; (ii) inside SAC305 solder alloy; and (iii) inside porous Cu. Energy dispersive X-ray spectroscopy (EDX) was used to identify intermetallic phases. Cu 6 Sn 5 phase with scallop-liked morphology was observed at the interface of the SAC305/Cu substrate. In contrast, the scallop-liked intermetallic phase together with more uniform but a less defined scallop-liked phase was observed at the interface of porous Cu and solder alloy.

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“…Although many studies on lead-free high-melting point solder have been conducted, the optimum substitute materials for Pb-rich solder have not been developed. Now, lead-free high-melting point solder is not regulated by RoHS restriction yet, but such lead-free solder is expected to be developed [1][2][3][4][5] . Pb-(5-10 mass%)Sn solder, however, are still considered the material of choice for high temperature applications due to the inherent limitations of Pb-free solders, including wettability, reliability, and cost 6) .…”

Section: Introductionmentioning

confidence: 99%

Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder

et al. 2016

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Tensile properties of three Bi-based lead-free solder which are pure Bi, Bi-1.0Ag-0.3Sn-0.03Ge (mass%), and Bi-2.5Ag (mass%) were investigated and compared with that of Pb-rich Pb-2.5Ag-2.5Sn (mass%) solder. Tensile strength of pure Bi is the minimum among solder investigated regardless of the temperature and strain state. Although tensile strength of Bi-based solder is lower than that of Pb-2.5Ag-2.5Sn at 25 C, those of Bi-1.0Ag-0.3Sn-0.03Ge and Bi-2.5Ag improve and become analogous and higher than that of Pb-2.5Ag-2.5Sn at a temperature of 125 C or more. The effect of strain rate on elongation is negligible in solder investigated. Although elongations of Bi-based lead-free solder are lower than that of Pb-2.5Ag-2.5Sn at 25 C, they increase with increasing temperature. While the elongation of Pb-2.5Ag-2.5Sn relatively stable at approximately 20-30% regardless of temperature, elongations of Bi-1.0Ag-0.3Sn-0.03Ge and Bi-2.5Ag become a same level with that of Pb-2.5Ag-2.5Sn at 125 C and 175 C. In particular, the ductility of pure Bi which is about 5% improves drastically at temperatures of 75 C or more and the elongation rises to approximately 60%. From microstructure observation results, it was con rmed that the addition of small amount of Sn and Ge is effective to form ne microstructure. From fracture surface observation results, it was con rmed that brittle fracture occurs at 25 C and the fracture mode changes to ductile fracture when the temperature increases and the ductility improves.

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High-temperature lead-free solder alternatives

Cited by 166 publications

References 29 publications

Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals in Principal Axes

Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals in Principal Axes

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder

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