Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics

Chidambaram, Vivek; Yeung, Ho Beng; Gao, Shan

doi:10.1007/s11664-012-2114-6

Cited by 52 publications

(25 citation statements)

References 6 publications

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“…The most widely used commercial Pb-free solder for high temperature applications is the Au-20Sn wt. % eutectic alloy (Te = 278°C) [58][59][60][61][62][63] [64][65][66][67][68][69][70] . For an HTI to be an acceptable substitute for high-Pb solders in a given application, the HTI must:…”

Section: High Temperature Interconnect Technologiesmentioning

confidence: 99%

Liquid-phase diffusion bonding and the development of a Cu-Ni/Sn composite solder paste for high temperature lead-free electrical connections

Choquette¹

2018

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Section: High Temperature Interconnect Technologiesmentioning

confidence: 99%

Liquid-phase diffusion bonding and the development of a Cu-Ni/Sn composite solder paste for high temperature lead-free electrical connections

Choquette¹

2018

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“…The most widely used commercial Pb-free solder for high temperature applications is the Au-20Sn wt.% eutectic alloy (T e = 278°C). [58][59][60][61][62][63] However, due to the high price of Au, Au-Sn alloys have been used primarily in high reliability applications including step-soldering in RF packages, hermetic sealing, aerospace, military, and medical electronics.…”

Section: High Temperature Interconnect Technologiesmentioning

confidence: 99%

Advances in Pb-free Solder Microstructure Control and Interconnect Design

Reeve

Holaday

Choquette

et al. 2016

J. Phase Equilib. Diffus.

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New electronics applications demanding enhanced performance and higher operating temperatures have led to continued research in the field of Pb-free solder designs and interconnect solutions. In this paper, recent advances in the microstructural design of Pb-free solders and interconnect systems were discussed by highlighting two topics: increasing b-Sn nucleation in Snbased solders, and isothermally solidified interconnects using transient liquid phases. Issues in bSn nucleation in Sn-based solders were summarized in the context of Swenson's 2007 review of the topic. Recent advancements in the areas of alloy composition manipulation, nucleating heterogeneities, and rapid solidification were discussed, and a proposal based on a multi-faceted solidification approach involving the promotion of constitutional undercooling and nucleating heterogeneities was outlined for future research. The second half of the paper analyzed two different approaches to liquid phase diffusion bonding as a replacement for high-Pb solders, one based on the application of the pseudo-binary Cu-Ni-Sn ternary system, and the other on a proposed thermodynamic framework for identifying potential ternary alloys for liquid phase diffusion bonding. All of the concepts reviewed relied upon the fundamentals of thermodynamics, kinetics, and solidification, to which Jack Smith substantially contributed during his scientific career.

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“…The Au/Ge system has been investigated for other applications such as alternatives to Pb containing solders [148][149][150] and as such, its structure has the been the focus of much examination [151][152][153][154] 152 . Comparatively, neutron diffraction has also been used to study the structure of a Au0.72Ge0.28 eutectic system 155 , while the electronic band structure of Au/Ge was investigated using angle-resolved photoemission and density functional theory calculations 156 .…”

Section: The Au/ge Systemmentioning

confidence: 99%

Recent advances in the growth of germanium nanowires: synthesis, growth dynamics and morphology control

et al. 2014

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Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics

Cited by 52 publications

References 6 publications

Liquid-phase diffusion bonding and the development of a Cu-Ni/Sn composite solder paste for high temperature lead-free electrical connections

Liquid-phase diffusion bonding and the development of a Cu-Ni/Sn composite solder paste for high temperature lead-free electrical connections

Advances in Pb-free Solder Microstructure Control and Interconnect Design

Recent advances in the growth of germanium nanowires: synthesis, growth dynamics and morphology control

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