This paper provides a brief summary of the state-of-the-art of MEMS-specific modeling techniques and describes the validation of new models for a parametric component library. Two recently developed 3D modeling tools are described in more detail. The first one captures a methodology for designing MEMS devices and simulating them together with integrated electronics within a standard electronic design automation (EDA) environment. The MEMS designer can construct the MEMS model directly in a 3D view. The resulting 3D model differs from a typical feature-based 3D CAD modeling tool in that there is an underlying behavioral model and parametric layout associated with each MEMS component. The model of the complete MEMS device that is shared with the standard EDA environment can be fully parameterized with respect to manufacturing-and design-dependent variables. Another recent innovation is a process modeling tool that allows accurate and highly realistic visualization of the step-by-step creation of 3D micro-fabricated devices. The novelty of the tool lies in its use of voxels (3D pixels) rather than conventional 3D CAD techniques to represent the 3D geometry. Case studies for experimental devices are presented showing how the examination of these virtual prototypes can reveal design errors before mask tape out, support process development before actual fabrication and also enable failure analysis after manufacturing.
A new hybrid 3D finite-element/behavioral-modeling approach is presented that can be used to accurately predict the nonlinear dynamics (parametric resonance) in electrostatically driven 2D resonant MEMS scanning mirrors. We demonstrate new levels of accuracy and speed for thick SOI scanning mirrors with large scanning angles and validate the modeling approach against measurement on a previously fabricated scanning mirror. The modeling approach is fast and treats the design parameters as variables thus enabling rapid design iterations, automatic sensitivity and statistical yield analyses, and integration with system and circuit simulators for coupled MEMS-IC cosimulation.
A general method of modeling and simulating a micro-machined inertial sensor under closed-loop control by a sigma-delta modulator is presented. The model of the mechanical subsystem captures all 6 mechanical degrees of freedom and the complex electrostatic fields in electrostatic comb drives. A technique is presented that makes transient simulations of the sophisticated mechanical model in conjunction with a modulator more tractable. The benefits of the modeling and simulation approach are demonstrated on an example consisting of a single-axis accelerometer and a second-order sigma-delta modulator. The example shows that transient simulations of the complete system can be performed in relatively short time while capturing cross coupling between mechanical modes of the sensor.
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