Novel 3D modeling methods for virtual fabrication and EDA compatible design of MEMS via parametric libraries

Abstract

This paper provides a brief summary of the state-of-the-art of MEMS-specific modeling techniques and describes the validation of new models for a parametric component library. Two recently developed 3D modeling tools are described in more detail. The first one captures a methodology for designing MEMS devices and simulating them together with integrated electronics within a standard electronic design automation (EDA) environment. The MEMS designer can construct the MEMS model directly in a 3D view. The resulting 3D model differs from a typical feature-based 3D CAD modeling tool in that there is an underlying behavioral model and parametric layout associated with each MEMS component. The model of the complete MEMS device that is shared with the standard EDA environment can be fully parameterized with respect to manufacturing-and design-dependent variables. Another recent innovation is a process modeling tool that allows accurate and highly realistic visualization of the step-by-step creation of 3D micro-fabricated devices. The novelty of the tool lies in its use of voxels (3D pixels) rather than conventional 3D CAD techniques to represent the 3D geometry. Case studies for experimental devices are presented showing how the examination of these virtual prototypes can reveal design errors before mask tape out, support process development before actual fabrication and also enable failure analysis after manufacturing.

Continuation-Based Pull-In and Lift-Off Simulation Algorithms for Microelectromechanical Devices

“…Based on their physical locations, the components are automatically connected and then the 2nd-order equation (1) is constructed based on a network analysis. For details, we refer the readers to [38], [39].…”

Addressing the Smart Systems design challenge: The SMAC platform

“…Latest advancement allows designers to compose MEMS behavioural model based designs in 3D and pass the model as netlist to an EDA platform for IC design [10].…”

“…Today, a variety of single-physics and multi-physics field solvers is available, ranging from general-purpose tools to those that address MEMS-specific physics such as electrostatic sensing and actuation, piezo-electric effects, and gas damping [10][11][12]. In the recent past, substantial improvements have been made in user-friendliness; automatic meshing algorithms, computational efficiency and results database management to link physical models with system level models [13].…”

SMAC: Smart Systems Co-design

“…Latest advancement allows designers to compose MEMS behavioural model based designs in 3D and pass the model as netlist to an EDA platform for IC design [9]. At physical level, power sources, sensors, MEMS and other discrete devices have traditionally been modelled using 3D field solvers based on the finite element method (FEM) and boundary element method (BEM).…”

“…At physical level, power sources, sensors, MEMS and other discrete devices have traditionally been modelled using 3D field solvers based on the finite element method (FEM) and boundary element method (BEM). Today, a variety of singlephysics and multi-physics field solvers is available, ranging from general-purpose tools to those that address MEMSspecific physics such as electrostatic sensing and actuation, piezo-electric effects, and gas damping [9], [10], [11]. In the recent past, substantial improvements have been made in userfriendliness, automatic meshing algorithms, computational efficiency, and results database management to link physical models with system level models [12].…”