Experimental Validation of Aluminum Nitride Energy Harvester Model with Power Transfer Circuit

Matova, S.; Hohlfeld, Dennis; Schaijk, R. van; Welham, Chris; Rouvillois, Stephane

doi:10.1016/j.proche.2009.07.360

Cited by 2 publications

(5 citation statements)

References 4 publications

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“…The difference between the behavior model and the finite element model is less than 1% in terms of simulated resonance frequency. This level of accuracy for ARCHITECT3D TM models is very typical and was multiple times observed for other types of models in the mentioned studies [6,[17][18][19][20][21][22][23]. The agreement between measurements and simulated results for the piezoelectric energy harvester is within 2%, for both the ARCHITECT TM and the finite element model.…”

Section: Model Validationsupporting

confidence: 73%

“…The agreement between measurements and simulated results for the piezoelectric energy harvester is within 2%, for both the ARCHITECT TM and the finite element model. In this case, the mismatch between the simulated resonance frequencies and the measured values is likely due to a difference in material properties [23]. The slight difference between the ARCHITECT3D TM and the finite element results can be attributed to the length (1.3 mm) to width (3 mm) ratio of the cantilever.…”

Section: Model Validationmentioning

confidence: 91%

“…A large number of articles have been published comparing different modeling tools using the above-mentioned validation schemes [6,[17][18][19][20][21][22][23], to name just a few. FEM techniques are well accepted and used across for applications.…”

Section: Model Validationmentioning

confidence: 99%

“…The validation of a newly developed piezoelectric (PZE) beam model is described in detail in [22,23]. The new PZE beam model used in the tool ARCHITECT3D TM [8] consists of a purely mechanical element and an electro-mechanical element describing the coupling as well as the electrical behavior of the piezo-electric layer.…”

Section: Model Validationmentioning

confidence: 99%

“…The new PZE beam model used in the tool ARCHITECT3D TM [8] consists of a purely mechanical element and an electro-mechanical element describing the coupling as well as the electrical behavior of the piezo-electric layer. It has been employed in piezoMEMS devices, such as energy harvesters [22,23], as shown in figure 2. This model also includes a power transfer circuit composed of a bridge rectifier with storage capacitor and resistive load.…”

Section: Model Validationmentioning

confidence: 99%

See 4 more Smart Citations

Novel 3D modeling methods for virtual fabrication and EDA compatible design of MEMS via parametric libraries

Schropfer

Lorenz

Rouvillois

et al. 2010

J. Micromech. Microeng.

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This paper provides a brief summary of the state-of-the-art of MEMS-specific modeling techniques and describes the validation of new models for a parametric component library. Two recently developed 3D modeling tools are described in more detail. The first one captures a methodology for designing MEMS devices and simulating them together with integrated electronics within a standard electronic design automation (EDA) environment. The MEMS designer can construct the MEMS model directly in a 3D view. The resulting 3D model differs from a typical feature-based 3D CAD modeling tool in that there is an underlying behavioral model and parametric layout associated with each MEMS component. The model of the complete MEMS device that is shared with the standard EDA environment can be fully parameterized with respect to manufacturing-and design-dependent variables. Another recent innovation is a process modeling tool that allows accurate and highly realistic visualization of the step-by-step creation of 3D micro-fabricated devices. The novelty of the tool lies in its use of voxels (3D pixels) rather than conventional 3D CAD techniques to represent the 3D geometry. Case studies for experimental devices are presented showing how the examination of these virtual prototypes can reveal design errors before mask tape out, support process development before actual fabrication and also enable failure analysis after manufacturing.

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