A first automated reel‐to‐reel fluidic selfassembly process for macroelectronic applications is reported. This system enables high‐speed assembly of semiconductor dies (15 000 chips per hour using a 2.5 cm‐wide web) over large‐area substrates. The optimization of the system (>99% assembly yield) is based on identification, calculation, and optimization of the relevant forces. As an application, the production of a solid‐state lighting panel is discussed, involving a novel approach to apply a conductive layer through lamination.

Various nanostructured sensor designs currently aim to achieve or claim single molecular detection by a reduction of the active sensor size. However, a reduction of the sensor size has the negative effect of reducing the capture probability considering the diffusion-based analyte transport commonly used. Here we introduce and apply a localized programmable electrodynamic precipitation concept as an alternative to diffusion. The process provides higher collection rates of airborne species and detection at lower concentration. As an example, we compare an identical nanostructured surfaced-enhanced Raman spectroscopy sensor with and without localized delivery and find that the sensitivity and detection time is improved by at least two orders of magnitudes. Localized collection in an active-matrix array-like fashion is also tested, yielding hybrid molecular arrays on a single chip over a broad range of molecular weights, including small benzenethiol (110.18 Da) and 4-fluorobenzenethiol (128.17 Da), or large macromolecules such as anti-mouse IgG (~150 kDa).

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A millimeter thin rubber‐like solid‐state lighting module is reported. The fabrication of the lighting module incorporates assembly and electrical connection of light‐emitting diodes (LEDs). The assembly is achieved using a roll‐to‐roll fluidic self‐assembly. The LEDs are sandwiched in‐between a stretchable top and bottom electrode to relieve the mechanical stress. The top contact is realized using a lamination technique that eliminates wire‐bonding.

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The detection of single binding has been a recent trend in sensor research introducing various sensor designs where the active sensing elements are nanoscopic in size. Currently, transport and collection of airborne analytes for gas sensors is either diffusion based or non-localized and it becomes increasingly unlikely for analytes to interact with sensing structures where the active area is shrunk, trading an increased sensitivity with a slow response time. This report introduces a corona discharge based analyte charging method and an electrodynamic nanolens based analyte concentration concept to effectively transport airborne analytes to sensing points to improve the response time of existing gas sensor designs. Localized collection of analytes over a wide range, including microscopic particles, nanoparticles, and small molecules, is demonstrated. In all cases, the collection rate is several orders of magnitudes higher than in the case where the collection is driven by diffusion. The collection scheme is integrated on an existing SERS (surfaceenhanced Raman spectroscopy) based sensor. In terms of response time, the process is able to detect analytes at 9 ppm (parts per million) within 1 s. As a comparison, 1 h is required to reach the same signal level when diffusion-only-transport is used.

Abstract-This paper reports on recent progress in the field of directed self-assembly, wherein discrete inorganic semiconductor device components are assembled on flexible substrates, and compares these results with prior work. The research aims to develop self-assembly-based chiplet assembly processes that can extend minimal die sizes and throughput beyond what is currently possible with robotic pick and place methods. This manuscript concentrates on self-assembly that is driven by the reduction of surface free energy between liquid solder-coated areas on a substrate and metal-coated contacts on semiconductor dies that act as binding sites. Scaling prior results to sub-100 micrometer-sized components has required a transition to a new self-assembly platform. Specifically, recent work has moved from a drum delivery concept to a new scheme that uses a stepwise reduction of interfacial free energy at a triple interface between oil, water, and a penetrating solder-patterned substrate to introduce components. Finally, this paper also discusses design rules to produce highly periodic "selftiled" domains on rigid, flexible, and curved substrates. We describe discrete, self-tiled, and microconcentrator-augmented solar cell modules as applications that are fault tolerant and reduce the amount of Si material used by up to a factor of 22 when compared to conventional cells.