Approaching Roll-to-Roll Fluidic Self-Assembly: Relevant Parameters, Machine Design, and Applications

Park, Se-Chul; Fang, Jun; Biswas, Shantonu; Mozafari, Mahsa; Stauden, Thomas; Jacobs, Heiko O.

doi:10.1109/jmems.2015.2452772

Cited by 18 publications

(22 citation statements)

References 28 publications

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“…For deterministic feeding, the components can be fed using a robotic pick-and-place device, either in series 17,117,123 or in parallel. 18,72,124 Parallel deterministic feeding includes laserinduced release and transfer from a donor substrate, 125,126 rollto-roll mechanisms, 12,127 parallel component handling over temporary carriers 92,124 and floatation. 59,76 Feeding can be accomplished also stochastically, as often done in fluidic selfassembly.…”

Section: Component Feedingmentioning

confidence: 99%

“…The structure hosting the assembly system can be a bath, 28,29,137 a rotating drum, 78 or a reel-to-reel machine. 127 The benefit lies in the parallelism and precision of the process achieved without high-precision mechanism. The drawback is the randomness of the assembly process, which leads to non-deterministic results and complicates the construction of sophisticated structures.…”

Section: Component Feedingmentioning

confidence: 99%

“…Nevertheless, randomness can be partly compensated by high components-toreceptors ratios, and highly efficient systems can be designed after careful engineering. 127 The feeding mechanism exploiting component floatation has demonstrated the highest assembly rate to date 59 (Fig. 14e).…”

Section: Component Feedingmentioning

confidence: 99%

“…The earliest and simplest strategy consists in the use of an electrically conductive fluid material as the medium for the self-alignment. Dating back to the original IBM's C4 process, 14 molten solder driven self-alignment 111,112 has been object of intense research through the years and is still actively employed in advanced implementations of parallel roll-to-roll stochastic assembly of microcomponents 12,59,78,127 (see also Sections 3.1.1 and 6.2.1). In this version of capillary self-alignment, a solder material is coated on the metal-finished surface of the receptor or of its fractions where the interconnections need to be established.…”

Section: Post-processingmentioning

confidence: 99%

“…In this version of capillary self-alignment, a solder material is coated on the metal-finished surface of the receptor or of its fractions where the interconnections need to be established. The solder can be applied in several ways, e.g., by dip-coating, 27,111,127 screen printing, or electroplating. 21,29,115 The high surface tension of the molten solder, wetting both receptor and component, promotes the final self-alignment.…”

Section: Post-processingmentioning

confidence: 99%

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Surface tension-driven self-alignment

et al. 2017

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Surface tension-driven self-alignment is a passive and highly-accurate positioning mechanism that can significantly simplify and enhance the construction of advanced microsystems. After years of research, demonstrations and developments, the surface engineering and manufacturing technology enabling capillary self-alignment has achieved a degree of maturity conducive to a successful transfer to industrial practice. In view of this transition, a broad and accessible review of the physics, material science and applications of capillary self-alignment is presented. Statics and dynamics of the self-aligning action of deformed liquid bridges are explained through simple models and experiments, and all fundamental aspects of surface patterning and conditioning, of choice, deposition and confinement of liquids, and of component feeding and interconnection to substrates are illustrated through relevant applications in micro- and nanotechnology. A final outline addresses remaining challenges and additional extensions envisioned to further spread the use and fully exploit the potential of the technique.

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Section: Component Feedingmentioning

confidence: 99%

Section: Component Feedingmentioning

confidence: 99%

Section: Component Feedingmentioning

confidence: 99%

Section: Post-processingmentioning

confidence: 99%

Section: Post-processingmentioning

confidence: 99%

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Surface tension-driven self-alignment

et al. 2017

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Technological Breakthroughs in Chip Fabrication, Transfer, and Color Conversion for High‐Performance Micro‐LED Displays

Ryu

Park

et al. 2023

Advanced Materials

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The implementation of high‐efficiency and high‐resolution displays has been the focus of considerable research interest. Recently, micro light‐emitting diodes (micro‐LEDs), which are inorganic light‐emitting diodes of size <100 µm2, have emerged as a promising display technology owing to their superior features and advantages over other displays like liquid crystal displays and organic light‐emitting diodes. Although many companies have introduced micro‐LED displays since 2012, obstacles to mass production still exist. Three major challenges, i.e., low quantum efficiency, time‐consuming transfer, and complex color conversion, have been overcome with technological breakthroughs to realize cost‐effective micro‐LED displays. In the review, methods for improving the degraded quantum efficiency of GaN‐based micro‐LEDs induced by the size effect are examined, including wet chemical treatment, passivation layer adoption, LED structure design, and growing LEDs in self‐passivated structures. Novel transfer technologies, including pick‐up transfer and self‐assembly methods, for developing large‐area micro‐LED displays with high yield and reliability are discussed in depth. Quantum dots as color conversion materials for high color purity, and deposition methods such as electrohydrodynamic jet printing or contact printing on micro‐LEDs are also addressed. This review presents current status and critical challenges of micro‐LED technology and promising technical breakthroughs for commercialization of high‐performance displays.

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Patterned Liquid Micro Rails for the Transport of Micrometer Sized Chips

Moreira,

Soydan,

Reiprich

et al. 2024

Adv Materials Technologies

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Transport and alignment of microscopic chips are important steps in microelectronics component integration with common approaches being pick‐and‐place, microfluidics, parallel transfer and self‐assembly. An alternate transport approach of microscopic chips is proposed using patterned liquid micro rails as chaperones. The surface free energy and interfacial free energy minimization of all constituents enable the creation of stable pathways. This allows for chip‐attachment to rails, while the liquid layer lubricates chip‐sliding. Monorails, digital monorails, and digital birails are investigated for chip movement behavior. Chip position and speed can be controlled using liquid flow in closed chambers. Speeds from 10 to 400 mm s−1 are achieved with translation distances as long as 50 mm. It is discovered that chips can selectively cross rail discontinuities of up to 500 µm, allowing for chip position control through a stop‐and‐go motion. A programmable liquid rails‐based chip conveyor system is demonstrated by transporting diodes to receptor sites where they undergo self‐assembly.

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Approaching Roll-to-Roll Fluidic Self-Assembly: Relevant Parameters, Machine Design, and Applications

Cited by 18 publications

References 28 publications

Surface tension-driven self-alignment

Surface tension-driven self-alignment

Technological Breakthroughs in Chip Fabrication, Transfer, and Color Conversion for High‐Performance Micro‐LED Displays

Patterned Liquid Micro Rails for the Transport of Micrometer Sized Chips

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