This paper introduces a method for self-assembling and electrically connecting small (20-60 micrometer) semiconductor chiplets at predetermined locations on flexible substrates with high speed (62500 chips/45 s), accuracy (0.9 micrometer, 0.14°), and yield (>98%). The process takes place at the triple interface between silicone oil, water, and a penetrating solder-patterned substrate. The assembly is driven by a stepwise reduction of interfacial free energy where chips are first collected and preoriented at an oil-water interface before they assemble on a solder-patterned substrate that is pulled through the interface. Patterned transfer occurs in a progressing linear front as the liquid layers recede. The process eliminates the dependency on gravity and sedimentation of prior methods, thereby extending the minimal chip size to the sub-100 micrometer scale. It provides a new route for the field of printable electronics to enable the integration of microscopic high performance inorganic semiconductors on foreign substrates with the freedom to choose target location, pitch, and integration density.As an example we demonstrate a fault-tolerant segmented flexible monocrystalline silicon solar cell, reducing the amount of Si that is used when compared to conventional rigid cells. flexible solar cells | fluidic self-assembly | macroelectronics | printable electronics | solder-directed self-assembly P rogress in the fields of microelectronics and microoptics has traditionally been measured by the level of overall miniaturization. The emerging field of macro and printable electronics, however, has a different set of goals and draws attention to new manufacturing methods that enable large-area integration, preferably on flexible low temperature plastic substrates. Manufacturing processes employed to deliver the integrated materials include inkjet printing, parallel transfer, robotic pick-and-place, and fluidic self-assembly. Inkjet printing is most suitable to produce low-performance devices, whereas parallel transfer, robotic pick-and-place, and fluidic self-assembly aim to integrate higher performance inorganic devices formed by high temperature processes prior to integration; inorganic devices provide orders of magnitudes higher switching speeds due to the much higher carrier mobility, occupy orders of magnitude less area due to the superior conductance and thus require less material and cost per function when compared to their organic counterparts. Motivated by the higher performance and cost advantage per function of inorganic semiconductors, parallel transfer (1-4) and self-assembly techniques (5-9) have been advanced in recent years to integrate, among others, ZnO (10), GaAs (7, 11), InP (12), GaN (13,14), and Si (2, 3, 8, 15, 16) on flexible low temperature substrates in a massively parallel fashion. Demonstrated applications include flexible (17) and curved displays (8), curved focal plane arrays (2), oscillators (3), radio frequency identification (RFID) tags (18), and solar cells (4). Transfer techniques, when...

This article reports a new integration approach to produce arrays of ZnO microcrystals for optoelectronic and photovoltaic applications. Demonstrated applications are n-ZnO/p-GaN heterojunction LEDs and photovoltaic cells. The integration process uses an oxygen plasma treatment in combination with a photoresist pattern on magnesium doped GaN substrates to define a narrow sub-100 nm width nucleation region. Nucleation is followed by lateral epitaxial overgrowth producing single crystal disks of ZnO with desired size over 2 in. wafers. The process provides control over the dimensions (<1% STD) and the location (0.7% STD pitch variation) of the ZnO crystals. The quality of the patterned ZnO is high; the commonly observed defect related emission in the electroluminescence spectra is completely suppressed, and a single near-band-edge UV peak is observed.

Indoor navigation technology is needed to support seamless mobility for the visually impaired. This paper describes the construction of and evaluation of a navigation system that infers the users' location using only magnetic sensing. It is well known that the environments within steel frame structures are subject to significant magnetic distortions. Many of these distortions are persistent and have sufficient strength and spatial characteristics to allow their use as the basis for a location technology. This paper describes the development and evaluation of a prototype magnetic navigation system consisting of a wireless magnetometer placed at the users' hip streaming magnetic readings to a smartphone processing location algorithms. Human trials were conducted to assess the efficacy of the system by studying route-following performance with blind and sighted subjects using the navigation system for real-time guidance.

Contact electrification creates an invisible mark, overlooked and often undetected by conventional surface spectroscopic measurements. It impacts our daily lives macroscopically during electrostatic discharge and is equally relevant on the nanoscale in areas such as soft lithography, transfer, and printing. This report describes a new conceptual approach to studying and utilizing contact electrification beyond prior surface force apparatus and point-contact implementations. Instead of a single point contact, our process studies nanocontact electrification that occurs between multiple nanocontacts of different sizes and shapes that can be formed using flexible materials, in particular, surface-functionalized poly(dimethylsiloxane) (PDMS) stamps and other common dielectrics (PMMA, SU-8, PS, PAA, and SiO(2)). Upon the formation of conformal contacts and forced delamination, contacted regions become charged, which is directly observed using Kelvin probe force microscopy revealing images of charge with sub-100-nm lateral resolution. The experiments reveal chemically driven interfacial proton exchange as the dominant charging mechanism for the materials that have been investigated so far. The recorded levels of uncompensated charges approach the theoretical limit that is set by the dielectric breakdown strength of the air gap that forms as the surfaces are delaminated. The macroscopic presence of the charges is recorded using force-distance curve measurements involving a balance and a micromanipulator to control the distance between the delaminated objects. Coulomb attraction between the delaminated surfaces reaches 150 N/m(2). At such a magnitude, the force finds many applications. We demonstrate the utility of printed charges in the fields of (i) nanoxerography and (ii) nanotransfer printing whereby the smallest objects are ∼10 nm in diameter and the largest objects are in the millimeter to centimeter range. The printed charges are also shown to affect the electronic properties of contacted surfaces. For example, in the case of a silicon-on-insulator field effect transistors are in contact with PDMS and subsequent delamination leads to threshold voltage shifts that exceed 500 mV.

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