A first automated reel‐to‐reel fluidic selfassembly process for macroelectronic applications is reported. This system enables high‐speed assembly of semiconductor dies (15 000 chips per hour using a 2.5 cm‐wide web) over large‐area substrates. The optimization of the system (>99% assembly yield) is based on identification, calculation, and optimization of the relevant forces. As an application, the production of a solid‐state lighting panel is discussed, involving a novel approach to apply a conductive layer through lamination.

Various nanostructured sensor designs currently aim to achieve or claim single molecular detection by a reduction of the active sensor size. However, a reduction of the sensor size has the negative effect of reducing the capture probability considering the diffusion-based analyte transport commonly used. Here we introduce and apply a localized programmable electrodynamic precipitation concept as an alternative to diffusion. The process provides higher collection rates of airborne species and detection at lower concentration. As an example, we compare an identical nanostructured surfaced-enhanced Raman spectroscopy sensor with and without localized delivery and find that the sensitivity and detection time is improved by at least two orders of magnitudes. Localized collection in an active-matrix array-like fashion is also tested, yielding hybrid molecular arrays on a single chip over a broad range of molecular weights, including small benzenethiol (110.18 Da) and 4-fluorobenzenethiol (128.17 Da), or large macromolecules such as anti-mouse IgG (~150 kDa).

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A millimeter thin rubber‐like solid‐state lighting module is reported. The fabrication of the lighting module incorporates assembly and electrical connection of light‐emitting diodes (LEDs). The assembly is achieved using a roll‐to‐roll fluidic self‐assembly. The LEDs are sandwiched in‐between a stretchable top and bottom electrode to relieve the mechanical stress. The top contact is realized using a lamination technique that eliminates wire‐bonding.

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