A First Implementation of an Automated Reel‐to‐Reel Fluidic Self‐Assembly Machine

Abstract

A first automated reel‐to‐reel fluidic selfassembly process for macroelectronic applications is reported. This system enables high‐speed assembly of semiconductor dies (15 000 chips per hour using a 2.5 cm‐wide web) over large‐area substrates. The optimization of the system (>99% assembly yield) is based on identification, calculation, and optimization of the relevant forces. As an application, the production of a solid‐state lighting panel is discussed, involving a novel approach to apply a conductive layer through lamination.

Concept for assembling individual nanostructure-based components into complex devices

“…39 And even more resource efficient parallel and unsupervised assembly processes can be also potentially adopted for this. [26][27][28][29] Hence, the assembly process may be further streamlined substantially lowering the associated costs.…”

“…So far such integration has been demonstrated only for micrometer-scale components, 12,[19][20][21][22][23][24][25] and it has been shown that heterogeneous integration can be done in a very efficient way by parallel and unsupervised self-assembly. [26][27][28][29] Micro-and nanoscale components are typically fabricated on rather thick (down to 25 lm, typically 200-300 lm thick) and large (down to 25 lm, typically 5-15 mm lateral dimensions) dies due to practical limitations regarding die a) Present address: International Iberian Nanotechnology Laboratory, Av.…”

Magnetic self-assembly with unique rotational alignment for thin chips

“…A non-contact micro-assembly method provides an advantage at this point: self-assembly enables organizing components into patterns autonomously, without a direct mechanical contact [1]. Part presentation can be performed in a stochastic [2,3] or directed fashion [4][5][6] in self-assembly. In stochastic presentation approach, the parts are manipulated randomly by agitation or vibration.…”

Metamorphic hemispherical microphone array for three-dimensional acoustics

“…13 The process is compatible with various types of chip attachment and assembly methods including solder bump based interconnects, flip-chip die attach, robotic pick-andplace, or engineered self-assembly using molten solder. 14,15 In the demonstrated case, we used a semi-automated pick-andplace process. The depicted demonstrator contains a total number of 5 analog MEMS microphones (3.76 Â 2.95 Â 1.2 mm, Knowles SPU0414HR5H-SB).…”