Nowadays flash memory is one of the most frequently used nonvolatile memories in electronic devices. However, since flash memory is based on Si transistors with floating gates which can store electronic charges, it has basic limitations in its speed and density. It takes longer than 1 lsec for electronic charges to be stored in a floating gate in one cell of flash memory. In addition, we'll reach density limitation in flash memory in the near future by conventional scaling methods, such as decrease in gate length or increase in dielectric constant of the gate oxide, which are commonly applied to Sibased 2-dimensional devices. Thus, in order to overcome the limitations of flash memory, we require a new nonvolatile memory which is not based on Si devices with electronic charge storing phenomena. Here we introduce a next generation nonvolatile memory consisting of two oxide resistors, NiO and VO 2 , where the former is a memory element storing data by utilizing so called bi-stable resistance switching and the latter is a switch element controlling access using the related threshold switching. Since the memory only utilizes resistance switching behaviors of the two oxide resistors, writing and reading times are around several 10s of ns. In addition, it overcomes density limitations by its compatibility with 3-dimensional stack structures due to its low processing temperature lower than 300°C. High performance tests show the feasibility of a universal memory which has advantages of both flash and static random access memories.Si-based flash memory has become the standard for nonvolatile memory which does not lose information in the absence of an external bias. Nonetheless it faces several barriers as cell size is reduced beyond the sub-micrometer region (currently having realized a 40 nm pattern for 32 gigabit NAND flash memory) [1] due to charge leakage across the tunnel oxide. In addition, it needs a little longer time (> 1 ls) to write information by storing charges in a floating gate of flash memory. The efforts of the semiconductor industries have been focused not only on developing scaling methods or modifying device structures for Si-based flash memories [1] but on finding a next generation memory using materials which can circumvent the fundamental limits of Si. The goal of a next generation memory is both to surpass flash memory for nonvolatile memory applications and to realize a universal memory which combines the advantages of nonvolatile slow memory such as flash memory and volatile fast memory such as static random access memory. In order to accomplish this, a class of materials and structures which have easy scalability and rapid programming speed in addition to nonvolatility and low power consumption must be developed. In general, nonvolatile memory consists of a memory element with bi-stable states under zero bias and a switch element with resistance controlled by external bias. The memory element stores the information and the switch element controls access to a specific memory element. Several gro...

For high density of resistive random access memory applications using NiOx films, understanding of the filament formation mechanism that occurred during the application of electric fields is required. We show the structural changes of polycrystalline NiOx (x=1–1.5) film in the set (low resistance), reset (high resistance), and switching failed (irreversible low resistance) states investigated by simultaneous high-resolution transmission electron microscopy and electron energy-loss spectroscopy. We have found that the irreversible low resistance state facilitates further increases of Ni filament channels and Ni filament density that resulted from the grain structure changes in the NiOx film.

The nature of magnetic ordering in LaCoO3 epitaxial thin films has been the subject of considerable debate. We present direct observations of the spin-state modulation of Co ions in LaCoO3 epitaxial thin films on an atomic scale using aberration-corrected scanning transmission electron microscopy (STEM), electron energy loss spectroscopy (EELS), and ab initio calculations based on density functional theory (DFT) calculations. The results of an atomic-resolution STEM/EELS study indicate that the superstructure is not associated with oxygen vacancies; rather, it is associated with a higher spin state of Co3+ ions and their ordering. DFT calculations successfully reproduced the modulation of lattice spacing with the introduction of spin ordering. This result identifies the origins of intrinsic phenomena in strained LaCoO3 and provides fundamental clues for understanding ferromagnetism in Co-based oxides.

Photoemission and ab initio theoretical study of interface and film formation during epitaxial growth and annealing of praseodymium oxide on Si (001)

Resistance change random access memory devices using NiOx films with resistance switching properties have immense potential for high-density nonvolatile memory exceeding currently used flash memory. The only critical failure of a NiOx film is to write wrong information due to large fluctuations of switching voltages during successive resistance switching operations. The authors show that failure-free NiOx film can be grown directly on Pt electrode just by process control. Intensive analyses show that the superior resistance switching behaviors of their simple Pt∕NiOx∕Pt structure may result from a very thin Ni–Pt layer self-formed at the bottom interface during deposition of NiOx.

Epitaxial NiO films have been fabricated on SrRuO3 films prepared on SrTiO3 single-crystal substrates. The x-ray diffraction spectra and transmission electron microscopy confirm the epitaxial growth of NiO with atomically flat surfaces on the SRO electrode. The I-V measurements of epitaxial NiO show the resistive memory switching behavior with a change in the polarity of the voltage bias, in contrast with the switching behavior of polycrystalline NiO by a single polarity. The I-V characteristics of epitaxial NiO prepared under various synthesis conditions and electrodes are presented, which suggests an important role of interfaces between NiO and electrodes on the resistive switching behavior.

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