For the development of resistive memory devices using NiO, improvements of several memory switching properties are required. In NiO memory cells with noble metal electrodes, broad dispersions of memory switching parameters are generally observed with continuous memory switchings. We report the improvements in minimizing the dispersions of all memory switching parameters using thin IrO2 layers between NiO and electrodes. The role of thin IrO2 layers on NiO growth and memory switching stabilization are discussed.

We investigated resistance switching in top-electrode/NiO∕Pt structures where the top electrode was Au, Pt, Ti, or Al. For Pt∕NiO∕Pt and Au∕NiO∕Pt structures with ohmic contacts, the effective electric field inside the film was high enough to induce trapping or detrapping at defect states and thus resistance switching. For a Ti∕NiO∕Pt structure with well-defined Schottky contact at Ti∕NiO interface accompanied by an appreciable voltage drop, the effective electric field inside the NiO film was not enough to induce resistance switching. For an Al∕NiO∕Pt structure with a low Schottky barrier at the Al∕NiO interface, resistance switching could be induced at a higher voltage since the voltage drop at the Al∕NiO interface was not negligible but small.

Epitaxial NiO films have been fabricated on SrRuO3 films prepared on SrTiO3 single-crystal substrates. The x-ray diffraction spectra and transmission electron microscopy confirm the epitaxial growth of NiO with atomically flat surfaces on the SRO electrode. The I-V measurements of epitaxial NiO show the resistive memory switching behavior with a change in the polarity of the voltage bias, in contrast with the switching behavior of polycrystalline NiO by a single polarity. The I-V characteristics of epitaxial NiO prepared under various synthesis conditions and electrodes are presented, which suggests an important role of interfaces between NiO and electrodes on the resistive switching behavior.

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