A metal-source flow-rate modulation epitaxy method is reported to enhance the hole concentration of Mg-doped AlGaN grown by metal organic chemical vapor deposition. The hole concentration of p-type AlGaN (Al content 0.43) is increased to 2.3 × 1017 cm−3 at room temperature by this method, which is about ten times higher than that of the conventional growth. The resistivity was found to be as low as 12.7 Ω·cm. Furthermore, the effective acceptor activation energy (EA) in the AlGaN films (Al content 0.32–0.43) was determined to be 20–22 meV, several times smaller than EA in p-GaN. Secondary ion mass spectroscopy measurements demonstrated that uniformly Mg-doped AlGaN structures with spatially modulated Al compositions were formed using this technique. It is suggested that the enhancement of hole concentration benefits from the modulation of the valence band edge.

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In this paper, crack‐free GaN films with step‐graded AlGaN transition layer and AlGaN superlattice layer as buffer layers were grown on Si(111) substrate by metal‐organic chemical vapor deposition(MOCVD). The combination of both buffers effectively improves the properties of GaN layer. With the optimization of the buffer structures, high quality compressively‐strained GaN layers with thickness up to 3.6 μm have been obtained on Si(111) substrates (© 2015 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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