Porous low-k materials are required in the construction of 45 nm node large-scale integrated devices. However, the extremely low Young's modulus values of these materials results in a high number of previously unreported defects. A porous low-k film stacked with a dense low-k film showed pronounced cracking in its Cu wiring, which was concentrated in isolated lines 0.18 m in width and was accelerated with longer chemical-mechanical polishing ͑CMP͒ times. Denser lines showed less cracking and the single structure of a dense low-k film showed no cracking. We hypothesized that this cracking might be categorized as stress corrosion cracking ͑SCC͒. Accordingly, we investigated the relation between stress and corrosion in certain kinds of slurry. We have also researched the effects on corrosion of temperature and various metals. In all of the slurry that we tested, tensile stress increased corrosion current in Cu samples. Furthermore, both finite element method analysis of stress during CMP and measurements of friction on the Cu/low-k surface by scanning probe microscopy indicated concentration of stress on low-k materials, especially at the edges of isolated wiring. Thus, we concluded that stress enhances corrosion during CMP and that there was a high possibility of SCC.

For the last 60 years, the development of cutting-edge semiconductor devices has strongly emphasized scaling; the effort to scale down current CMOS devices may well achieve the target of 5 nm nodes by 2020. Planarization by chemical mechanical polishing (CMP), is one technology essential for supporting scaling. This paper summarizes the history of CMP transitions in the planarization process as well as the changing degree of planarity required, and, finally, introduces innovative technologies to meet the requirements. The use of CMP was triggered by the replacement of local oxidation of silicon (LOCOS) as the element isolation technology by shallow trench isolation (STI) in the 1980s. Then, CMP’s use expanded to improving embedability of aluminum wiring, tungsten (W) contacts, Cu wiring, and, more recently, to its adoption in high-k metal gate (HKMG) and FinFET (FF) processes. Initially, the required degree of planarity was 50 nm, but now 0 nm is required. Further, zero defects on a post-CMP wafer is now the goal, and it is possible that zero psi CMP loading pressure will be required going forward. Soon, it seems, everything will have to be “zero” and perfect. Although the process is also chemical in nature, the CMP process is actually mechanical with a load added using slurry particles several tens of nm in diameter. Zero load in the loading process, zero nm planarity with no trace of processing, and zero residual foreign material, including the very slurry particles used in the process, are all required. This article will provide an overview of how to achieve these new requirements and what technologies should be employed.

The effects of oxynitridation and wet oxidation at the interface of SiO2/4H-SiC(0001) and were investigated using both electrical and physical characterization methods. Hall measurements and split capacitance–voltage (C–V) measurements revealed that the difference in field-effect mobility between wet oxide and dry oxynitride interfaces was mainly attributed to the ratio of the mobile electron density to the total induced electron density. The surface states close to the conduction band edge causing a significant trapping of inversion carriers were also evaluated. High-resolution Rutherford backscattering spectroscopy (HR-RBS) analysis and high-resolution elastic recoil detection analysis (HR-ERDA) were employed to show the nanometer-scale compositional profile of the SiC-MOS interfaces for the first time. These analyses, together with cathode luminescence (CL) spectroscopy and transmission electron microscopy (TEM), suggested that the deviations of stoichiometry and roughness at the interface defined the effects of oxynitridation and wet oxidation at the interface of SiO2/4H-SiC(0001) and .

In-situ electrochemical measurements made during polishing and in a static state were performed for copper and barrier metals in two kinds of copper slurries, using a rotating disk electrode apparatus. For all metals, current density during polishing in the slurry when using APS as an oxidizer was greater than when using H 2 O 2 as an oxidizer, due to the strong reactivity of APS with exposed metal surfaces. The potential of Ru during polishing is greater than that of Cu, indicating that Ru is more noble than Cu and suggesting the high potential for Cu galvanic corrosion in APS slurry. In the case of Ta, Cu is more noble than Ta, rendering Cu stable. In H 2 O 2 slurry, Ru and Cu show similar potential and low current density, rendering Cu stable. However, dipping an exposed metal barrier window led to abrupt changes in Cu potential in all slurries, a finding that suggests Cu may generate corrosion.

We have investigated phosphorus ion ͑P + ͒ implantation in Si nanocrystals ͑SiNCs͒ embedded in SiO 2 , in order to clarify the P donor doping effects for photoluminescence ͑PL͒ of SiNCs in wide P concentrations ranging in three orders. Some types of defects such as P b centers were found to remain significantly at the interfaces between SiNCs and the surrounding SiO 2 even by high-temperature ͑1000°C͒ annealing of all the samples. Hydrogen atom treatment ͑HAT͒ method can efficiently passivate remaining interface defects, leading to significant increase in the intensity of PL arising from the recombination of electron-hole pairs confined in SiNCs, in addition to significant decrease in interface defects with dangling bonds detected by electron spin resonance. From both the results of the P dose dependence before and after HAT, it is found that the amount of remaining defects is higher for samples with SiNCs damaged by implantation with relatively lower P + doses and then annealed, and that through HAT the observed PL intensity increases surely as the P concentration increases up to a critical concentration. Then it begins to decrease due to Auger nonradiative recombination above the critical concentration which depends on the size of SiNCs. These results suggest an effect of relatively low concentration of P atoms for the enhancement of PL intensity of SiNCs and we present an unconventional idea for explaining it.