In this paper, we present the fabrication process of a shape memory alloy (SMA) thin film in both monolithic and hybrid configurations. This provides an effective actuation part for a gripper made of SU-8 thick photoresist. We also extensively describe and discuss the assembly of the SMA thin film with the SU-8 mechanism. Measurements show that the SU-8 gripper is able to achieve an opening action of 500 μm in amplitude at a frequency of 1 Hz. Finite element model simulations indicate that a force of 50 mN, corresponding to 400 μm of opening amplitude, should be produced by the SMA actuator. Although the assembly of the TiNi SMA thin film with the SU-8 mechanism is demonstrated, the bond reliability needs further development in order to improve the thermal behavior of the interface. In this paper, we show that SU-8 is well suited as a structural material for microelectromechanical systems (MEMS) applications. An attractive feature in the MEMS design is that the SMA generated force is well matched with the elastic properties of SU-8. From the application point of view, a SMA-actuated SU-8 high-aspect-ratio microgripper can serve as a secure means to transport microelectronics device, because it provides good grasping and safe insulation. This is also a preliminary result for the future development of biogrippers.

No abstract

We report a theoretical investigation, free of any adjustable parameters, concerning the size and shape effects on the melting enthalpy, for different shapes of "free-standing" nanostructures. To easily calculate the nanoscale melting enthalpy for a wide range of metals and semiconductors, a convenient shape parameter (R shape ) is defined. A comparison between the Guisbiers et al., Jiang et al., and Shandiz et al. models with experimental and molecular dynamics results is done. Until D ∼ 10 nm, the size effect on the melting entropy can be neglected.

The absorption coefficient of thick-films of the negative photoresist SU-8 is observed to be time dependent during photolithographic exposure by I-line ultraviolet light (λ=365nm); varying linearly from 38±1cm−1 to 49±1cm−1 for a surface exposure dose of 415mJ∕cm2. We develop a general model which enables the exposure dose to be calculated at a given photoresist depth for a given exposure time. We determine the critical exposure dose for the subsequent polymerization of SU-8 having an arbitrary thickness to be 49.4±3.9mJcm−2.