In this paper, we present the fabrication process of a shape memory alloy (SMA) thin film in both monolithic and hybrid configurations. This provides an effective actuation part for a gripper made of SU-8 thick photoresist. We also extensively describe and discuss the assembly of the SMA thin film with the SU-8 mechanism. Measurements show that the SU-8 gripper is able to achieve an opening action of 500 μm in amplitude at a frequency of 1 Hz. Finite element model simulations indicate that a force of 50 mN, corresponding to 400 μm of opening amplitude, should be produced by the SMA actuator. Although the assembly of the TiNi SMA thin film with the SU-8 mechanism is demonstrated, the bond reliability needs further development in order to improve the thermal behavior of the interface. In this paper, we show that SU-8 is well suited as a structural material for microelectromechanical systems (MEMS) applications. An attractive feature in the MEMS design is that the SMA generated force is well matched with the elastic properties of SU-8. From the application point of view, a SMA-actuated SU-8 high-aspect-ratio microgripper can serve as a secure means to transport microelectronics device, because it provides good grasping and safe insulation. This is also a preliminary result for the future development of biogrippers.

The study of the electrical properties of DNA has aroused increasing interest since the last decade. So far, controversial arguments have been put forward to explain the electrical charge transport through DNA. Our experiments on DNA bundles manipulated with silicon-based actuated tweezers demonstrate undoubtedly that humidity is the main factor affecting the electrical conduction in DNA. We explain the quasi-Ohmic behavior of DNA and the exponential dependence of its conductivity with relative humidity from the adsorption of water on the DNA backbone. We propose a quantitative model that is consistent with previous studies on DNA and other materials, like porous silicon, subjected to different humidity conditions.

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