Variation of absorption coefficient and determination of critical dose of SU-8 at 365 nm

Gaudet, Matthieu; Camart, J.C.; Buchaillot, L.; Arscott, S.

doi:10.1063/1.2164390

Cited by 63 publications

(56 citation statements)

References 8 publications

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“…The same process without reflection coating was also recently reported [64]. Another alternative was adding a top layer of a positive resist which can partially absorbs the UV light [30].…”

Section: Partial Exposure and Direct Writingmentioning

confidence: 83%

SU‐8 as a structural material for labs‐on‐chips and microelectromechanical systems

et al. 2007

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Since its introduction in the nineties, the negative resist SU-8 has been increasingly used in micro- and nanotechnologies. SU-8 has made the fabrication of high-aspect ratio structures accessible to labs with no high-end facilities such as X-ray lithography systems or deep reactive ion etching systems. These low-cost techniques have been applied not only in the fabrication of metallic parts or molds, but also in numerous other micromachining processes. Its ease of use has made SU-8 to be used in many applications, even when high-aspect ratios are not required. Beyond these pattern transfer applications, SU-8 has been used directly as a structural material for microelectromechanical systems and microfluidics due to its properties such as its excellent chemical resistance or the low Young modulus. In contrast to conventional resists, which are used temporally, SU-8 has been used as a permanent building material to fabricate microcomponents such as cantilevers, membranes, and microchannels. SU-8-based techniques have led to new low-temperature processes suitable for the fabrication of a wide range of objects, from the single component to the complete lab-on-chip. First, this article aims to review the different techniques and provides guidelines to the use of SU-8 as a structural material. Second, practical examples from our respective labs are presented.

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“…The same process without reflection coating was also recently reported [64]. Another alternative was adding a top layer of a positive resist which can partially absorbs the UV light [30].…”

Section: Partial Exposure and Direct Writingmentioning

confidence: 83%

SU‐8 as a structural material for labs‐on‐chips and microelectromechanical systems

et al. 2007

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“…[25] Using Equation 2, we calculated the absorption coefficient as well as the absorption depth (1/a) for all compositions ( Table 1). The absorption coefficient of 5.2 Â 10 À2 mm À1 is in good agreement with previous studies.…”

Section: Resultsmentioning

confidence: 99%

“…According to Table 1, the absorption depth at 3% w/w is about 1.2 mm which is clearly smaller than the layer thickness (2.9 mm). Considering that the photopolymerization process starts from the top of the sample, [25] this result indicates that only around 40% of the layer was polymerized through its thickness at the interference maxima positions. However, since the material in contact with the substrate was not cured, the solid SU-8 strips could be easily detached during the development step.…”

Section: Resultsmentioning

confidence: 99%

Layer‐by‐Layer Interference Lithography of Three‐dimensional Microstructures in SU‐8

2009

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We report on rapid fabrication of two‐, two and a half‐, and 3D planar periodic structures using layer‐by‐layer deposition and interference patterning of SU‐8 photoresist. Complex structures with non‐periodic vertical symmetry were fabricated controlling the cure depth by addition of a UV absorber. The fabrication method reported here can be applied for the high‐volume manufacturing of solid structures for microelectromechanical systems and microfluidic devices.

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“…The intensity of the light propagating in the resist can be calculated from the UV absorption of the resist [19]:…”

Section: Simulation Of 3d Microstructure Shapementioning

confidence: 99%

“…The critical exposure dose of SU-8 ( ) was estimated from Ref. [19] to be 95 mJ/cm 2 . Thus, the shape of the microstructure can be expressed as:…”

Section: Simulation Of 3d Microstructure Shapementioning

confidence: 99%

Moving-mask Lithography for 3D Microstructure Molding

Kato

Kai

Hirano

2014

J. Photopol. Sci. Technol.

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Backside lithography with a moving mask UV exposure technique is proposed. A novel moving-mask exposure apparatus was developed and evaluated both experimentally and through exposure simulations. The backside exposure using this technique was validated and is capable of producing tapered microstructures of thick photoresist for molding. The shape of the structure can be modified by the trajectory of the stage movement. It was confirmed that the shape of the processed structure could be successfully predicted using the proposed simulation method.

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Variation of absorption coefficient and determination of critical dose of SU-8 at 365 nm

Cited by 63 publications

References 8 publications

SU‐8 as a structural material for labs‐on‐chips and microelectromechanical systems

SU‐8 as a structural material for labs‐on‐chips and microelectromechanical systems

Layer‐by‐Layer Interference Lithography of Three‐dimensional Microstructures in SU‐8

Moving-mask Lithography for 3D Microstructure Molding

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