The form factor of mobile devices and their associated thermal dissipation characteristics present practical limits to SoC (and specifically CPU) power consumption. Multiple maximum temperature constraints interact with the thermal "time constant" of package and product to limit allowable die temperature. This can constrain maximum CPU frequency in real use cases. The co-design of product and process technology is required to maximize thermally constrained performance. Technology features, device Ieff/Ioff setpoints, and circuit design styles are all levers to optimize thermally constrained performance. A methodology for early prediction of product sensitivities to these levers is required to enable their definition sufficiently early in the development cycle of the technology node.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.