Unified Technology Optimization Platform using Integrated Analysis (UTOPIA) for holistic technology, design and system co-optimization at <= 7nm nodes

Outlook of device and assembly technologies enabling high-performance mobile computing

“…Higher bulk resistivity of non-Cu solutions is already apparent in the power distribition and this would require selective high-aspect ratio metallization for those PDN networks [2]. In order to resolve the increasing resistance of signal routing, a hierarchical wiring approach such as scaling of line length can overcome the problem of increasing wire resistance per datapath [8]. Table 2 shows the evolution of number of interconnect levels and wirelength of each data path stage as projected by IRDS.…”