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Polyimide is of great interest in the field of MEMS and microtechnology. It is often used for its chemical, thermal, mechanical, and optical properties. In this paper, an original study is performed on controlled variation of polyimide film wettability. A two-step microtexturing method is developed to transform hydrophilic polyimide surfaces into a superhydrophobic surface with low magnitude of hysteresis (Δθ ≈ 0° and contact angle θ ≈ 158°). This method is based on the conception of a new kind of fakir surface with triangular cross-section micropillars, the use of a two-scale roughening, and a C(4)F(8) coating. We demonstrate that the absence of hysteresis is related to a combination of two scales of structuring and the pillar shape. The technology that has been developed results in the simultaneous fabrication of adjacent superhydrophobic and superhydrophilic small areas, which allows an effect of self-positioning of water droplets when deposited on such a checkerboard-like surface.

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In this work, a new approach for the one-step integration of interdigitated electrodes on macroporous silicon substrates is presented. Titanium/gold interdigitated electrodes are used to pattern p-type silicon substrates prior the anodization in an organic electrolyte. The electrolyte characteristics, conductivity, and pH have been found to affect the adherence of the metal layer on the silicon surface during the electrochemical etching. The impact of the metal pattern on size distribution and morphology of the resulting macroporous silicon layer is analyzed. A formation mechanism supported by finite element simulation is proposed.

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