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Articles you may be interested inStructural and electrical characteristics of high-k Tb 2 O 3 and Tb 2 TiO 5 charge trapping layers for nonvolatile memory applications

In this letter, we investigated the structural and electrical characteristics of high-κ Er2O3 and Er2TiO5 gate dielectrics on the amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistor (TFT) devices. Compared with the Er2O3 dielectric, the a-IGZO TFT device incorporating an Er2TiO5 gate dielectric exhibited a low threshold voltage of 0.39 V, a high field-effect mobility of 8.8 cm2/Vs, a small subthreshold swing of 143 mV/decade, and a high Ion/Ioff current ratio of 4.23 × 107, presumably because of the reduction in the oxygen vacancies and the formation of the smooth surface roughness as a result of the incorporation of Ti into the Er2TiO5 film. Furthermore, the reliability of voltage stress can be improved using an Er2TiO5 gate dielectric.

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We investigated the impact of Ti doping in the Sm2O3 dielectric on the electrical stress-induced instability in amorphous indium-gallium-zinc oxide (a-IGZO) thin-film transistors (TFTs). With increasing stress time in a-IGZO TFT devices, a small initial positive shift followed by a negative shift of threshold voltage is characterized in the Sm2O3 dielectric, whereas only positive shift of threshold voltage is observed for Ti-doped Sm2O3 dielectric. The positive shift of the threshold voltage can be explained by charge trapping in the Sm2O3 film and/or the Sm2O3/IGZO interfaces, while the negative shift of threshold voltage is probably due to the extra charges from the IGZO channel by self-heating effect.

In this study, we report the structural and electrical characteristics of high-κ Sm2O3 and SmTiO3 charge trapping layers on an indium–gallium–zinc oxide (IGZO) thin-film transistor (TFT) for non-volatile memory device applications.

In this study, we investigated the structural properties and electrical characteristics of metal/oxide/high-k material/oxide/silicon (MOHOS)-type memory devices incorporating Tb2O3 and Tb2TiO5 films as charge storage layers for nonvolatile memory applications. X-ray diffraction and x-ray photoelectron spectroscopy revealed the structural and chemical features of these films after they had been subjected to annealing at various temperatures. From capacitance-voltage measurements, we found that the MOHOS-type memory devices incorporating the Tb2TiO5 film and that had been annealed at 800 °C exhibited a larger flatband voltage shift of 2.94 V (Vg=9 V for 0.1 s) and lower charge loss of 8.5% (at room temperature), relative to those of the systems that had been subjected to other annealing conditions. This result suggests that Tb2TiO5 films featuring a thinner silicate layer and a higher dielectric constant provide a higher probability for trapping of the charge carrier and deeper electron trapping levels.